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STS PECVD Tool

The STS is a plasma-enhanced chemical vapor deposition system which is used for low temperature (350°C) deposition of oxide, nitride, and oxynitride.
STS PECVD, sts
The STS is a plasma-enhanced chemical vapor deposition system which is used for low temperature (350°C) deposition of oxide, nitride, and oxynitride. Features:1) Low temperature PECVD (350°C) of silicon dioxide, silicon nitride, and oxynitride. 2) Large deposition electrode: up to 5 - 3", 4 - 4" wafers or a single 6" wafer can be accomodated. 3) Programmable dual frequency operation for precise stress control.
STS Deposition Recipes
This page shows some of recipe parameters and resulting deposition rates and stresses

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