Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Equipment / Dry Etching

Dry Etching

Table and Overview of available etchers at SNF

This chart gives a quick reference to the available plasma etchers at SNF and SNSF.

Table and Overview of available etchers at SNF - Read More…

General Information on Plasma Etching

In this folder you will find general information about plasma etching at SNF. Topics included are; description of plasma etch systems available, how plasma etching works, tips and tricks, using non-standard sample sizes, etc.

General Information on Plasma Etching - Read More…

AMT 8100 Plasma Etcher, amtetcher (semi-clean)

The amtetcher is a Reactive Ion Etcher that uses fluorine based chemistry to etch Oxides or Nitrides. Also can be used for Si trench etching.

AMT 8100 Plasma Etcher, amtetcher (semi-clean) - Read More…

Gasonics Aura Plasma Asher, gasonics (semi-clean)

The Gasonics Aura Asher is an automated upstream microwave plasma system used for stripping photoresist of clean 4 inch silicon wafers.

Gasonics Aura Plasma Asher, gasonics (semi-clean) - Read More…

Applied Materials Precision 5000 Etcher, p5000etch (semi-clean)

The Applied Materials Precision 5000 Etcher is a "cluster" tool, consisting of four, independently-controlled etch chamber modules which surround a central loadlock.

Applied Materials Precision 5000 Etcher, p5000etch (semi-clean) - Read More…

STS Deep RIE Etcher, stsetch (semi-clean)

This is a IPC (Inductive Charged Plasma) Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.

STS Deep RIE Etcher, stsetch (semi-clean) - Read More…

Oxford III-V Etcher

The Oxford Instruments PlasmaPro System 100 Cobra III-V Etcher was acquired in late 2011 for precision etching of III-V compounds. It is currently approved to etch GaAs, InGaAs, InAs, InP, InGaAsP, and GaP only. Please contact Jim McVittie (mcvittie@stanford.edu) for approval to etch other substrates.

Oxford III-V Etcher - Read More…

Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl)

SNF has three Plasma Therm dry etchers for deep Si etching (pt-dse), metal etching (pt-mtl) and dielectric etching (pt-ox). The operating software is common to the three etchers and a software description is located in this folder. You will also find the available default process steps and parameter limits for each tool. Individual folders for the etchers are located in this folder as well.

Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl) - Read More…

Oxford-rie

Oxford-RIE etcher for etching SiO2, SiN, polyimide etc

Oxford-rie - Read More…

Document Actions