Drytek2 Model 100, drytek2 (semiclean)
The Drytek plasma etchers at SNF all use chlorine and fluorine-based chemistry for etching various Si, polysilicon, nitride, tungsten, tungsten silicide films. Drytek4 (contaminated) also has additional capabilities for oxide etching and argon sputter etching.
Quick Start Instructions allow user to have a handy condensed version of the Operating Instructions. The user, however, is responsible for having read and understood the full version of the machine operating instructions.
Recent process quals are given for quick reference.
This procedure is to be performed by maintenance staff. The purpose is to balance electrode power to yield as consistent etch performance across all electrodes as possible.