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You are here: Home / Equipment / Dry Etching / Drytek2 Model 100, drytek2 (semiclean) / NEW! Recent Process qualifications

NEW! Recent Process qualifications

Recent process quals are given for quick reference.

Recent Process Qualifications by Date

 

8 Jan 2014

Comments; etch rates for selected commonly used materials.  Tested after annual Winter shutdown.  Recipe used POLY ETCH (150mT, 400W, SF6 117sccm, F22 51sccm, 2 min)

 

Electrode #
Poly Etch Rate
A/min
Single Crystal Si

PR 3612

Thermal Ox

Poly : PR
Selectivity
Poly : Ox

1 1355  7287 (?)
279
201 4.9 : 1
6.7 : 1
2 1199  1267 228
168
5.3 : 1
7.1 : 1
3 1246  1213 224
134
5.6 : 1
9.3 : 1
4 1099  1221 194
123 5.7 : 1
8.9 : 1
5 1168  1404 209
132
5.6 : 1
8.8 : 1
6 1166  1388 211
133 5.5 : 1
8.8 : 1
Average All
1205  1298 (not including electrode #1)
226
148 5.3 : 1
8.1 : 1

 

Nitride etch rates were also tested; NITRIDE ETCH recipe (150mT, 500W, SF6 100 sccm, O2 10 sccm, 2 min)

Electrode #
Nitride Etch rate
A/min
 1  795
 2  691
 3  754
 4  758
 5  750
 6  732
 Average All
 751


9 Jan 2013

Comments; etch rates for selected commonly used materials.  Tested after annual Winter shutdown.  Recipe used POLY ETCH (150mT, 400W, SF6 117sccm, F22 51sccm, 2 min)

 

Electrode #
Poly Etch Rate
A/min
Single Crystal Si

PR 3612

Thermal Ox

Poly : PR
Selectivity
Poly : Ox

1 1565  1683 370 205 4.2 : 1
7.6 : 1
2 1612  1810 371 202 4.3 : 1
8.0 : 1
3 1640  1882 341 205 4.8 : 1
8.0 : 1
4 1528  1761 361 194 4.2 : 1
7.9 : 1
5 1590  1851 377 201 4.2 : 1
7.9 : 1
6 1506  1677 357 189 4.2 : 1
8.0 : 1
Average All
1573  1777 362 199 4.3 : 1
7.9 : 1


24 Feb 2012

Comments; poly etch rates by electrode and position on the wafer after renovation and electrode balancing, poly etch program, 2  mins, polysilicon samples.

 

Electrode #
Center
A/min
Top
Bottom
Right
Left
Average
1 1314 1313 1275 1525 1232 1292
2 1263 1201 1219 1221 1186 1218
3 1315 1204 1297 1277 1278 1275
4 1244 1221 1211 1219 1199
1219
5 1296 1240 1229 1283 1241 1258
6 1285 1190 1219 1272 1220 1237

 

28 Sept 2011

 

Comments; after RF power supply rebuild and in preparation for allowing contaminated wafers to be etched using bottom two electrodes, poly etch program, 2 mins, polysilicon samples.

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1 1343 304
143 4 : 1
9 : 1
2 1461 295
154 5 : 1
9 : 1
3 1396 304
147 5 : 1
9 : 1
4 1720
387
188 4 : 1
9 : 1
5 1404 292
159 5 : 1
8 : 1
6 1353 305
154 4 : 1
9: 1
Average All
1446
315
157
4.5 : 1
8.8 : 1

Also ran tests on Nitride etch program.

 

Electrode
Number
Nitride Etch Rate
Thermal Ox Etch Rate
Selectivity
1 834A 253 3.3 : 1
2 860 256 3.4 : 1
3 831 250 3.3 : 1
4 1085 320 3.4 : 1
5 909 271 3.4 : 1
6
870 264 3.3 : 1
Average All
898 269 3.4 : 1

 

5 Jan 2011

 

Comments; after annual lab shutdown, poly etch program, 2 mins, polysilicon samples.

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1 1952 273
141 7.2 : 1
13.8 : 1
2 1946 251
134 7.8 : 1
15.0 : 1
3 1735 230
113 7.5 : 1
15.4: 1
4 1824
244
113 7.5 : 1
16.1 : 1
5 1943 268
137 7.3 : 1
14.2 : 1
6 1864 283
140 6.5 : 1
13.3 : 1
Average All
1877 258
130 7.3 : 1
14.6 : 1

 

For comparison sake single crystal silicon also tested;

Electrode Number
Single Crystal Si
Etch Rate- A/Min
1 3280
2 3277
3 2895
4 3001
5 3286
6 3165
Average All
3151

 

7 Jan 2010

 

Comments; after annual lab shutdown, poly etch program, 2 mins, polysilicon samples.

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1 1730 454
132 3.8 : 1
13.1 : 1
2 1720 480
130 3.6 : 1
13.2 : 1
3 1379 377
110 3.7 : 1
12.5: 1
4 1424
395 119 3.6 : 1
12.0 : 1
5 1619 455
138 3.6 : 1
11.7 : 1
6 1500 414
130 3.6 : 1
11.5 : 1
Average All
1562 429
127 3.7 : 1
12.3 : 1

 

For comparison sake single crystal silicon also tested;

Electrode Number
Single Crystal Si
Etch Rate- A/Min
1 1623
2 1534
3 1203
4 1292
5 1325
6 1395
Average All
1395

30 Sept 2009

Comments; poly etch program, 2 minutes, polysilicon samples, after electrode balancing performed.

 

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1 1703 307 119 5.5 : 1
14.3 : 1
2 1713 332 129 5.6 : 1
13.3 : 1
3 1888 347 142 5.4 : 1
13.3 : 1
4 1707 329 138 5.2 : 1
12.3 : 1
5 1841 328 140 5.6 : 1
13.2 : 1
6 1661 312 129 5.3 : 1
12.9 : 1
Average All
1752 326 133 5.4 : 1
13.2 : 1

 

17 Sept 2009

 

Comments; after manometer and blower replacement

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1  1936  202  135  9.6 : 1
 14.3 : 1
2  2188  283  169  7.7 : 1
 12.9 : 1
3  1140  120  83  9.5 : 1
 13.7 : 1
4  1906  266  151  7.2 : 1
 12.6 : 1
5  1582  200  100  7.9 : 1
 15.8 : 1
6  1815  227  142  8.0 : 1
 12.8 : 1
Average All
 1761  216  130  8.2 : 1
 13.5 : 1

 

8 Jan 2009

 

Comments; after RF repair- coil = 075, cap = 550, drifted to 375W

Electrode Number
Poly
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Poly : PR
Selectivity
Poly : Ox
Selectivity
1  1777  273  120  6.5 : 1
 14.8 : 1
2  2019  357  163  5.7 : 1
 12.4 : 1
3  1808  308  139  5.9 : 1
 13.0 : 1
4  1832  299  142  6.2 : 1
 12.9 : 1
5  1864  301  143  6.2 : 1
 13.0 : 1
6  1811  332  150  5.5 : 1
 12.1 : 1
Average All
 1852  312  143  6.0 : 1
 13.0 : 1

For comparison single crystal Si also tested.

 

Electrode Number
Si Etch Rate
A/min
1 2364
2 2921
3 2568
4 2484
5 2523
6- not tested
-

 

 

7 Aug 2008

 

Comments; after electrode clean- coil = 039, cap = 745, 400W 20 refl.  Note: single crystal Si used for tests.

Electrode Number
Single Crystal Si
 Etch Rate A/min
PR (3612)
Etch Rate A/min
Thermal Ox
Etch Rate A/min
Si : PR
Selectivity
Si : Ox
Selectivity
1  2558  292  126  8.8 : 1
 20.3 : 1
2  2890  391  161  7.4 : 1
 36.6 : 1
3  2632  329  133  8.8 : 1
 19.8 : 1
4  3088  335  156  9.2 : 1
 19.8 : 1
5  2722  311  130  8.8 : 1
 20:9 : 1
6  2822  353  120  8.0 : 1
 23.5 : 1
Average All
 2785  335  138  8.3 : 1
 20.2 : 1

 

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