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You are here: Home / Equipment / Dry Etching / Drytek2 Model 100, drytek2 (semiclean) / Standard Recipes and Etch Rates for Drytek2

Standard Recipes and Etch Rates for Drytek2


Recipe

Descum

Resist Strip

Polymer Clean Up

Isotropic Poly/Si Etch

Nitride Etch

Poly/Si Etch

Contact Clean Up

Process #

1

1

1

3

3

2

3

 

 

 

 

 

 

 

 

Gas Switches- On

4

4

4

1, 4

2, 4

2, 3

1

                      - Off

1, 2, 3

1, 2, 3

1, 2, 3

2, 3

1, 3

1, 4

2, 3, 4

 

 

 

 

 

 

 

 

Gas

O2

O2

O2

O2

O2

SF6

 

Flow (sccm)

100

100

100

10

10

117

 

 

 

 

 

 

 

 

 

Gas

 

 

 

CF4

SF6

F22

CF4

Flow (sccm)

 

 

 

100

100

51

100

 

 

 

 

 

 

 

 

Chamber Pressure

150mT

500mT

150mT

300mT

150mT

150mT

150mT

 

 

 

 

 

 

 

 

RF Power

500W

500W

500W

700W

500W

400W

500W

 

 

 

 

 

 

 

 

Estimated Etch Rates

 (A/min)

 

 

 

 

 

 

 

Thermal Ox

-

-

-

186

90

172

30

LTO Und

-

-

-

95*

90

138

25

4% Und LTO

-

-

-

237*

245

 

 

8% Und LTO

-

-

-

215*

340

 

 

LTO Dens

-

-

-

86*

215

 

 

4% Dens LTO

-

-

-

271*

200

 

 

8% Dens LTO

-

-

-

155*

240

 

 

Nitride

-

-

-

83*

650

 

 

Low Stress Nitride

-

-

-

315*

975

488

35

Undoped Poly

-

-

-

900

 

1604

120

Silicon

-

-

-

2800

 

2785

120

3612 resist

440

220

244

630

 

335

20

SPR220-7

396

399

 

 

 

 

79

SPR220-3

384

502

 

 

 

 

120

PMMA 2%

888

382

 

 

 

 

149

PMMA 5%

907

480

 

 

 

 

145

PMMA 9%

698

485

 

 

 

 

145

ZEP520-12

 

 

 

 

 

 

 

ZEP520-22

 

 

 

 

 

 

 

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