Materials That are Unacceptable for Attaching Samples to Carrier Wafers
Low melting point, sloppy.
Although it is used in some of the metallization systems it can't be used to attach samples to carrier wafers in the etchers. Exposure to plasma woulds be a bad thing, esp in ICP systems.
It gets everywhere quickly.
Difficult to apply to carrier wafer without getting onto unwanted surfaces- gets everywhere.
Exposure to the plasma may cause redeposition, esp harmful to ICP systems.