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Materials That are Unacceptable for Attaching Samples to Carrier Wafers

Here is a list of prohibited materials used in other labs or facilities that have been tried in SNF but rejected as not compatible with tools and processes. They are presented as informational only.

Black Wax

 Low melting point, sloppy.

Silver Paste

 Although it is used in some of the metallization systems it can't be used to attach samples to carrier wafers in the etchers.  Exposure to plasma woulds be a bad thing, esp in ICP systems.

Oil

It gets everywhere quickly.

Cool Grease

 Difficult to apply to carrier wafer without getting onto unwanted surfaces- gets everywhere.

Copper Mesh

Exposure to the plasma may cause redeposition, esp harmful to ICP systems.

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