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Oxford-RIE etcher for etching SiO2, SiN, polyimide etc

Operating Instructions- Ox-RIE

Thanks to Yunhan Chen and Monica Hew for the operating instructions. Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and oxygen. It belongs to the "Flexible" group.

Operating Instructions- Ox-RIE - Read More…

SiO2 Etch Characterization

CHF3/CF4 process characterization - Data Collected by Ken Leedle and summarized by Yunhan Chen

SiO2 Etch Characterization - Read More…

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