Oxford-rie
Oxford-RIE etcher for etching SiO2, SiN, polyimide etc
Operating Instructions- Ox-RIE
Thanks to Yunhan Chen and Monica Hew for the operating instructions. Oxford-rie is a capacitively coupled plasma (ccp) etch equipment with fluorine based etch gases and oxygen. It belongs to the "Flexible" group.
SiO2 Etch Characterization
CHF3/CF4 process characterization - Data Collected by Ken Leedle and summarized by Yunhan Chen
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