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PlasmaTherm Deep Silicon Etcher (pt-dse)

The Versaline LL-DSE Deep Silicon Etcher was acquired in late 2011 for DRIE silicon etching on substrates containing non-MOS materials.

PlasmaTherm-DSE (PT-DSE) Capabilities, Specifications and Operation

PT-DSE is an ICP (Inductively Coupled Plasma) etch system configured for Si etches using Bosch process. This equipment belongs to the "Contaminated" group.

PlasmaTherm-DSE (PT-DSE) Capabilities, Specifications and Operation - Read More…

Process Step for Plasma-Therm DSE (Deep Silicon Etch) System

Process steps are added together to create process sequences for Versaline tools. This process step is specific to the DSE tool. It lists all the parameters and their limits to be used in recipe writing.

Process Step for Plasma-Therm DSE (Deep Silicon Etch) System - Read More…

Recipe Development and Start Up Data

This folder contains the site acceptance report and data created during the initial recipe development phase.

Recipe Development and Start Up Data - Read More…

Shallow Silicon Etch Recipe Development Efforts

The DSE can be used to etch shallow trenches or thin poly/amorphus Si structures. The profile and sidewall result can be an issue depending on customer needs.

Shallow Silicon Etch Recipe Development Efforts - Read More…

Selected Recipes for PT-DSE

The folder contains some recipes commonly used int eh PlamaTherm Deep Silicon Etcher.

Selected Recipes for PT-DSE - Read More…

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