STS Simulated Recipe Test Run
This process is based on a 2 step STS process (2 sec dep, 3 sec etch) The STS process also used a 45W Bias during deposition and no Ar The customer required no specifications to meet for this process
|Dep||Etch A||Etch B|
|Electrode Temp (°C)||0||0||0|
|Lid Temp (°C)||150||150||150|
|Liner Temp (°C)||70||70||70|
|Spool Temp (°C)||180||180||180|
|He pressure (Torr)||4||4||4|
( ) indicates gas flow, but is dumped to exhaust bypass.
This keeps the flow rate more stable during switching than turning on/off the MFC.