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Summary of Results

Parameter  Customer
Requirement 
FAT Result
(TiW etched) 
Etch Rate (Å/min)  ≥3000  3121
Selectivity (TiW : PR)  0.50 : 1  0.42 : 1 
Wafer Uniformity (%)
(6mm edge exclusion) 
≤±5%  ± 3.95 % 
Run to Run Uniformity (%)  ≤±3%  ± 1.90 % 

 

  • For the FAT results, etch rate, selectivity, and wafer uniformity are the average results from 3 wafers
  • Run to Run Uniformity was based on 4 identical etch runs 

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