PlasmaTherm Oxide Etcher (pt-ox)
PT-OX is an ICP (inductively Coupled Plasma) etch system configured for dielectric etching. Etch chemistry is mainly fluorine based. It has both optical and laser endpoint systems.
Process steps are added together to create process sequences for Versaline tools. This process step the default step specific to the PT-OX (Deep Dielectric Etch) tool. It lists all the parameters and their limits to be used in recipe writing.
Suggested recipes for the etcher are located here.
This folder contains studies, EE412 Project reports and special project information by interested Labmembers.