Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Equipment / Dry Etching / Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl) / PlasmaTherm Oxide Etcher (pt-ox)

PlasmaTherm Oxide Etcher (pt-ox)

The Versaline LL-ICP Oxide Etcher was acquired in late 2011 for precision silicon oxide and deep glass/quartz etching.

PT-OX Capabilities, Specifications and Operation

PT-OX is an ICP (inductively Coupled Plasma) etch system configured for dielectric etching. Etch chemistry is mainly fluorine based. It has both optical and laser endpoint systems.

PT-OX Capabilities, Specifications and Operation - Read More…

Process Step for Plasma-Therm Deep Dielectric Etch System (pt-ox)

Process steps are added together to create process sequences for Versaline tools. This process step the default step specific to the PT-OX (Deep Dielectric Etch) tool. It lists all the parameters and their limits to be used in recipe writing.

Process Step for Plasma-Therm Deep Dielectric Etch System (pt-ox) - Read More…

Characterization

This folder contains studies, EE412 Project reports and special project information by interested Labmembers.

Characterization - Read More…

Document Actions