Equipment Description and Operating Instructions for Plasma Therm Dielectric Etcher (pt-ox)
- Picture and Location
- Process Capabilities
- Contact List and How to Become a User
- Operating Procedures
- Process Monitoring and Machine Qualification
Picture and Location
The tool is located at XXYY on the Lab Map.
Performance of the Tool
What the Tool CAN do
- Item A.
What the Tool CANNOT do
- Item A.
Contact List and How to Become a User
The following people make up the Tool Quality Circle:
- Process Staff: Nancy
- Maintenance: Elmer
- Super-Users: Jim Kruger (firstname.lastname@example.org)
Training to Become a Tool User
General Information about Plasma Therm Versaline Software
PT-Ox Rules of Engagement- Is this the right tool for you?
Here is information that may be used to determine if PT-Ox is the best tool for you work.
- No metal etching or sputtering is allowed. One concern is that sputtered metals may coat and hence short out the chamber.
- Due to the mechanical clamp and the possibility the wafer sticking to it Edge Bead Removal (EBR) is required. An EBR of 2mm is minimum; 5mm is better. Rare exceptions to this rule are only when a thin resist is used, for example, 955 resist.
- Many users want to etch oxide which will be used as an etch mask for the PlasmaTherm DRIE system (PT-DSE). Selectivity for various oxides are; ccp SiO300-1 = 200 : 1, ccp SiO350-1 = 400 : 1 (almost as good as Thermal Oxide).
- For the standard ox etch recipe (jkPRmask OxSTD) the selectivity of photoresist is 1.5 : 1. The recipe can be modified to achieve 3.5 : 1 but polymer deposition increases and a post etch polymer clean (seO2Clean-1) is needed to clean the chamber. Polymer may need to etched off the sample, too.
- The software that runs the pt-ox is the same as runs three other systems. It is described here.
- Here is a typical process sequence step for the pt-ox system. It contains ranges and min/max for various parameters.
Special Considerations for Use of the Tool (Hints and Tips)
Transparent Wafers (quartz, pyrex, sapphire or glass) present unique loading issues. A procedure for the loading of these substrates can be found here.