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You are here: Home / Equipment / Dry Etching / Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl) / PlasmaTherm Oxide Etcher (pt-ox) / Equipment Description and Operating Instructions for Plasma Therm Dielectric Etcher (pt-ox)

Equipment Description and Operating Instructions for Plasma Therm Dielectric Etcher (pt-ox)

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short description
Contents
  1. Picture and Location
  2. Background
  3. Process Capabilities
    1. Cleanliness Standard
    2. Performance of the Tool
  4. Contact List and How to Become a User
    1. Contact List
    2. Training to Become a Tool User
  5. Operating Procedures
  6. Process Monitoring and Machine Qualification
    1. Tool Qualification Run
    2. Machine Status States
    3. Process Monitoring Results

Picture and Location

 

The tool is located at XXYY on the Lab Map.

Background

 

Process Capabilities

Cleanliness Standard

 

Performance of the Tool

What the Tool CAN do

  • Item A.

 

What the Tool CANNOT do

  • Item A.

 

Process Monitoring

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

  • Process Staff: Nancy
  • Maintenance: Elmer
  • Super-Users: Jim Kruger (jimkruger@yahoo.com)

 

Training to Become a Tool User



General Information about Plasma Therm Versaline Software

PT-Ox Rules of Engagement- Is this the right tool for you?

Here is information that may be used to determine if PT-Ox is the best tool for you work.

  • No metal etching or sputtering is allowed.  One concern is that sputtered metals may coat and hence short out the chamber.
  • Due to the mechanical clamp and the possibility the wafer sticking to it Edge Bead Removal (EBR) is required.  An EBR of 2mm is minimum; 5mm is better.  Rare exceptions to this rule are only when a thin resist is used, for example, 955 resist.
  • Many users want to etch oxide which will be used as an etch mask for the PlasmaTherm DRIE system (PT-DSE).  Selectivity for various oxides are; ccp SiO300-1 = 200 : 1, ccp SiO350-1 = 400 : 1 (almost as good as Thermal Oxide).
  • For the standard ox etch recipe (jkPRmask OxSTD) the selectivity of photoresist is 1.5 : 1.  The recipe can be modified to achieve 3.5 : 1 but polymer deposition increases and a post etch polymer clean  (seO2Clean-1) is needed to clean the chamber.  Polymer may need to etched off the sample, too.
  • The software that runs the pt-ox is the same as runs three other systems.  It is described here.
  • Here is a typical process sequence step for the pt-ox system.  It contains ranges and min/max for various parameters.

Operating Procedures

 

Special Considerations for Use of the Tool (Hints and Tips)

 

Transparent Wafers (quartz, pyrex, sapphire or glass) present unique loading issues.  A procedure for the loading of these substrates can be found here.

Process Monitoring and Machine Qualification

Tool Qualification Run

 

Frequency

 

Procedure

 

Responsibility

 

 

Recommendation to users with critical processes

 

Machine Status States

Red:

Yellow:

Green:

 

Process Monitoring Results

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