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Typical Plasma Therm Versaline Process Sequence Steps

This folder contains typical process steps that make up a process sequence (recipe) for all the PlasmaTherm Versaline etchers and deposition systems. Although there are many common parameters to all of the tools, each contains unique entries. The process steps shown here are the standard default forms that contain gases, min and max flows, RF setpoints, etc... They are used as starting steps to create recipes and are presented here so that labmembers may know the capabilities and limits of the tools.
Process Step for Plasma-Therm High Density PECVD System
Process steps are added together to create process sequences for Versaline tools. This process step is the default step specific for the HD PECVD tool. It lists all the parameters and their limits to be used in recipe writing.
Process Step for Plasma-Therm DSE (Deep Silicon Etch) System
Process steps are added together to create process sequences for Versaline tools. This process step is specific to the DSE tool. It lists all the parameters and their limits to be used in recipe writing.
Process Step for Plasma-Therm Deep Dielectric Etch System (pt-ox)
Process steps are added together to create process sequences for Versaline tools. This process step the default step specific to the PT-OX (Deep Dielectric Etch) tool. It lists all the parameters and their limits to be used in recipe writing.
Process Step for Plasma-Therm Metal Etch System (pt-mtl)
Process steps are added together to create process sequences for Versaline tools. This process step is the default step specific to the PT-MTL (Metal Etch) tool. It lists all the parameters and their limits to be used in recipe writing.
Definition of Terms Used in Process Steps
Some of the chosen parameters have options that are not obvious to users new to the PlasmaTherms. This is especially true for the RF power and tuning system. Listed are definitions of the options. Special thanks to Jim McVittie for these descriptions.

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