Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Equipment / Dry Etching / STS Deep RIE Etcher, stsetch (semi-clean) / Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher

A. A. Ayón, R. Braff, C. C. Lin, H. H. Sawin, and M. A. Schmidt. Journal of The Electrochemical Society, 146 (1) 339-349 (1999)

PDF document icon Schmidt-1999.pdf — PDF document, 589 kB (603351 bytes)

Document Actions