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STS HRM Deep RIE Etcher, stsetch2

This is a Multiplex Pro ASE HRM Deep Reactive Ion etcher from Surface Technology Systems. The platform is single-chamber, manual loadlock system with a 2-wafer loading carousel. The etch process is based on the patented Laermer and Schlip process, commonly referred to as the Bosch Process. The etch process alternates between the passivating C4F8 plasma and the silicon etching SF6 plasma.

Picture and Location

 

Background

 STSetch2 is a Mesc Multiplex Pro ASEHRM deep reactive ion etcher manufactured by Surface Technology Systems (STS).  Deep reactive ion etch utilizes the Bosch Process.  The Bosch etch process involves alternating between a Si etch step (using SF6) and a fluoropolymer deposition (using C4F8).  During the deposition step the fluoropolymer is deposited on all of the sample surfaces.  During the etch step, ion assisted etching of the fluoropolymer is used removed from the bottom of your etch feature exposing the silicon to the etch chemistry while retaining the fluoropolymer on the sidewalls. 

Process Capabilities

Cleanliness Standard

Semi-clean

 

 

Performance of the Tool

What the Tool CAN do

  • Item A.

 

What the Tool CANNOT do

  • Item A.

 

Process Monitoring

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

  • Process Staff:
  • Maintenance:
  • Super-Users:

 

Training to Become a Tool User

 

Operating Procedures

 

Safety Hazards

 

WARNING: Proper use and safe operating of the equipment is the responsibility of the user of the system.  All lab members who work with or are exposed to this equipment must take precautions to protect themselves against possible injury.  Do not be careless around this, or any equipment.

 

WARNING: Electrical: High RF voltages may be present on this unit.  Use EXTREME CAUTION when working around any power supply or power distribution areas.  High voltage exists throughout the system.  Observe standard electrical safety precautions to avoid personal injury or damage to the equipment.

 

WARNING: Do not remove any covers or touch any lead wires to avoid electrical shock.

 

WARNING: Moving Parts: Keep hands, hair, tools and loose clothing away from any moving parts to avoid personal injury or damage to the equipment.

 

Emergency Shutdown Procedures

Depressing the Emergency Off (EMO) will instantly de-energize and remove all power to the system.  Only depress the EMO button in cases of potential danger to a person or significant damage to the equipment. 

 

Initial System Status Check

  • Check Coral to verify the system is not Enabled by another Lab Member.
  • View the Coral Maintenance page for any Shutdown, Problems or Comments.
  • Check the Alarm page for any red alarms.
  • Report any Red Alarms to either Maintenance or Process Engineering and add a Shutdown statement on Coral.

 

  1. Clear any Yellow Alarms.
  2.       If a Yellow Alarm can not be cleared report the alarm to either Maintenance or Process Engineering and add a Problem statement on Coral

 

  •    Enable the system on Coral.

 

Importing and exporting recipe

  • The USB port is available for Importing and Exporting recipes.  Using the USB functionality will allow you to protect your recipe from unexpected modifications.
  • Plug your USB stick in to the USB hub.
  • Touch or Click on the RECIPE icon located at the bottom of the screen.
  • If you are Importing a recipe, Touch or Click on the Process Module Folder.

 

  1.    Touch or Click on the Import Icon on the right side of the control window.
  2.       This will open up a browser window.  Find the desired recipe and highlight it by Touching or Clicking on the file (.XML format)
  3.      Touch or Click on OK in the browser window.

 

  • If you are Exporting a recipe, Touch or Click on the Process Module Folder.

 

  1. Scroll through the recipe list to find the desired recipe.
  2. Touch or Click on the Export Icon on the right side of the control window.
  3. This will open up a browser window.  Find the desired location to save the recipe and highlight it by Touching or Clicking on the file (.XML format)
  4.    Touch or Click on OK in the browser window.

 

  • To remove your USB stick, press the WINDOWS key on the keyboard

 

  1. This will display the control bar at the bottom of the monitor.
  2. Using the mouse, Left Click on the Unplug or Eject Hardwar icon.
  3. Click on the Stop USB Mass Storage Drive (F:)
  4.    Once it is safe to remove the USB drive, remove the USB stick from the USB hub.

 

  • Click on OK in the pop-up drive window.

 

Choosing and Editing a Recipe

  • Touch or Click on the RECIPE icon located at the bottom of the screen.

 

  1. Recipes are located in the Process Module Folder.

 

  • Open the Process Module folder, if required.
  • Scroll through the recipe list to find the desired recipe.

 

NOTE: The template recipes have been locked.  You can not change any parameters associated with these recipes.  You can make changes to the data fields, but these changes will not be downloaded to the HRM module and will not change while running a recipe.

 

  • Touch or Click on the desired recipe icon to open the recipe.
  • All main recipes should have the following sub recipe programs in the following order:

 

  1.   Clamp Substrate.
  2. Leak up Test
  3. Pump to Base
  4. Dep/Etch, Etch or any combination or number of similar steps
  5. Declamp Substrate.

 

WARNING: The Clamp Substrate, Leak up Test, Pump to Base and Declamp Substrate recipes are standard recipes and are not to be modified by Lab Members.

 

  • The Dep/Etch sub recipe(s) can be customized within acceptable process boundaries by Lab Members.

 

  1. Touch the Dep/Etch sub recipe icon and review the individual recipe steps and parameters and verify they are correct.
  2.   Recipe fields are edited by touching or clicking on the field and typing in the desired value(s).

 

  • If no changes are made to the recipe, touch the AUTOMATIC icon.
  • If a change is made you will need to touch the APPLY icon to update the recipe to save the change(s).
  • If you do not want to update any change(s) to the recipe, touch the DISCARD icon.

 

Verify the Status of the System

  • Touch on the AUTOMATIC icon.
  • Verify the previous process is complete and the status of the system before processing.
  • Verify there are no machine control subroutines running.

 

  1. Subroutine Icons are located above the system control page. 
  2. Subroutines include TMC, Batch and, or HRM.

 

  • If a machine subroutine is running, the system is still running a requested process.

 

  1. Review the Automatic screen and verify there are not wafer Icons displayed on the system. 

 

  • The wafers Icons can be grey (not processed), yellow (in process), green (completed) or pink (failed) and can be located in the load lock or in the process chamber.
  • If a wafer Icon is displayed in the process chamber, you will need to get a flash light and look through the top window to verify it is present.

 

WARNING: The plasma is extremely bright.  Do not look in to the HRM module if the plasma is running or might turn on.

 

  •   If the wafer is there, but broken you need to notify Maintenance or Process Engineering and add a Shutdown statement on Coral.
  • If a wafer is present and not broken, then use the Removing Stranded Wafer process described below to remove the wafer.

 

Removing a Wafer from the HRM Module

  • Touch or Click on the MANUAL icon located at the lower left area of the screen.
  • Touch or Click on the Transfer Module tab located in the upper right area of the control screen.
  • Wafers are indicated by either a grey (not processed), Yellow (in process), pink (aborted) or green (completed process) color at the wafer position.
  • Verify there are no machine control subroutines running.

 

  1. Subroutine Icons are located above the system control page.

 

  • Verify the wafer is not broken.

 

  1.   Get a flash light and look through the top window to verify it is not broken.
  2.    If the wafer is broken you need to notify Maintenance or Process Engineering and add a Shutdown statement on Coral.

 

WARNING: The plasma is extremely bright.  Do not look in to the HRM module if the plasma is running or might turn on.

 

  • Highlight one wafer by Touching or Clicking on the wafer icon.
  • Touch or Click on an open position of the carousel in the Load Lock Chamber.
  • Touch or Click on the START icon located in the lower right area of the control screen.

 

  1.     The system will run an automated subroutine to move the wafer from the initial position to the final location you chose.

 

  •   Wait until the transfer is complete.

 

  1.   The TMC icon, located at the top of the computer screen will disappear when the automated subroutine is complete.

 

  • Touch or Click on the Vent icon to start the Load Lock venting subroutine.

 

  1. The Load Lock is vented when the TMC icon, located at the top of the computer screen disappears.

 

  • Open the Load Lock lid and remove your wafer.
  • They system is now ready for additional processing.
  • If no further processing is required.

 

  1.   Close and latch the Load Lock Lid.
  2. Touch or Click on the Pump icon.
  3. Once the TMC icon has disappeared, you can disable the system on Coral.

 

Running a Recipe

  • Verify the tool is Enabled on Coral.
  • Touch or Click on the Automatic icon located in the lower left portion of the control window.
  •   Touch or Click on the Production Batches tab located in the upper right portion of the control window.
  • Touch or Click on the Vent icon to start the Load Lock venting subroutine.

 

  1. The Load Lock is vented when the TMC Abort icon, located at the top of the computer screen disappears.

 

  • Open the Load Lock and place your wafers with the flats toward the center of the carousel with the wafer flats aligned to the marks on the carousel.

 

  1. Close and latch the Load Lock Lid.

 

  • Touch or Click on the Pump icon.

 

  1. Wait until the Load Lock has been pumped down and the TMC Abort icon disappears.

 

  • Touch or Click on the Map Carousel icon.

 

  1. Wait until your wafer(s) are found and the TMC Abort icon disappears.

 

  • Verify the system successfully found all your wafers.
  • Touch or Click on the Batch Recipe Pull Down icon of the Automatic window, located in the upper right portion of the control window.
  • Touch or Click on either the Next or Previous icon until your desired recipe appears on the list.
  • Touch or Click on the desired recipe, making sure it appears in the control line.
  • If the desired recipe appears in the control line, Touch or Click on the Start icon under the Batch Recipe window.

 

  •                  The Batch Confirmation window appears.

 

  1. Touching or Clicking on the Start icon in the Batch Confirmation window begins the down loading of your recipe to the control software.  No changes can be made to the recipe without aborting the process.

 

WARNING: You must reselect your recipe to download the most recent version.  If you made changes to your recipe and did not reselect it at this time, your wafers will not be etched using the recipe modifications.

 

  • The system will automatically move your wafer to the HRM module, run the process and return the wafer to the wafer carousel in the TMC module when completed.

 

  1. When the recipe has completed all of the TMC, Batch and HRM icons will disappear and your wafer will be located on the wafer carousel.

 

  • Touch or Click on the Vent icon to start the Load Lock venting subroutine.

 

  1. The Load Lock is vented when the TMC Abort icon, located at the top of the computer screen disappears.

 

  • Open the Load Lock lid and remove your wafer.
  • The system is now ready for additional processing by following the above sequence.
  • If no further processing is required.
  • Close and latch the Load Lock Lid.
  • Touch or Click on the Pump icon.

 

  1.   Once the TMC Abort icon has disappeared, you can disable the system on Coral.

 

Monitoring The Etch Process

  •   During the processing the Automatic screen will indicate the wafers are Processing at the upper right and will have the Stop, Pause and Abort icons active.  NOTE:  The functionality of the Pause and Abort buttons are not clear.  However the Abort button does seem to work.
  • Once the wafers have been loaded into the chamber a process count down timer will be displayed at the upper left of the screen.  This count down timer is visible on every screen.
  • Touch or Click on the MANUAL icon located at the lower left portion of the control screen.
  • Touch the Process (HRM1) icon at the lower left of the computer screen.
  • Touch or Click on the Trace tab located at the middle of the display on the right side.
  • This screen displays the various numerical values for the parameters associated with the etch chamber.
  • You can follow your etch by looking at the various trace values or the component values on this screen.

 

NOTE: The wafers are prone to shifting during the clamping and declamping  process.  It is very risky to run two back to back recipes without bringing the wafers to atmosphere and recentering them on the carousel  Without recentering the wafers you may break your wafer during clamping or drop the wafer in the chamber and the system will need to go down to maintenance to retrieve your wafer and condition the etch chamber.

 

UNLOADING THE WAFERS

  • Touch the AUUTOMATIC icon.
  • The tracking bar at the top right of the screen should say complete and the wafer color should be green (complete) or red (faulted).
  • Touch the VENT icon to vent the Load Lock.

 

  1. The Load Lock is vented when the TMC Abort icon, located at the top of the computer screen disappears.

 

  • Remove your wafers.
  • Close and latch the Load Lock lid and Touch the PUMP icon.

 

  1. Once the Transfer Module has pumped down and the TMC Abort icon is gone, disable the system on Coral.

 

12.  RETREIVING WAFERS STRANDED IN THE HRM ETCH CHAMBER

  • The following procedure works if there are no system hard faults.
  • Touch or Click on the MANUAL icon.
  • Touch or Click on the Transfer Module tab icon at the lower left of the screen.
  • Touch or Click on the Substrate Transfer tab icon at the upper right of the screen.
  • Touch or Click on the Wafer icon which is stranded in the etch chamber.

 

  1.   This selects the Transfer Source.

 

  • Touch or Click on the open position in the Load Lock.

 

  1. This selects the Transfer Destination.

 

  • Touch or Click on the START icon, located at the lower right of the screen.
  • Once the system has completed the wafer transfer, you can unload the wafer following the Unloading Your Wafer(s) section.

 

Process Monitoring and Machine Qualification

Tool Qualification Run

 

Frequency

 

Procedure

 

Responsibility

 

 

Recommendation to users with critical processes

 

Machine Status States

Red:

Yellow:

Green:

 

Process Monitoring Results

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