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Metalization Summary Page

Process
Equipment Name
Metals Thickness Range Wafer Size
Maximum Load
 Materials/
Equip Group
 Comment
Evaporation              
  Innotec SNF supplied: Ag, Al, Au, Co, Cr, Cu, Fe, Ge, In, Mo, Ni, Pd, Pt, Si, Ti, Ta, W

Approved/not supplied :  Er, Hf, Ir, Ru, Tb, Y
  pieces to 4 inch 22 four
 inch
wafers
Cont
Precious metals limit is <200nm 
  Intlvac_evap SNF Supplied: Al, Co, Cr, Ge, Hf, Mo, Nb, Ni, Pd, Pt, Si,Ta, Ti, V, W and Zr

Pieces to 4 inch
4, four inch wafers
Clean, Semi-Clean
 
Sputtering              
  Metalica Ag, Al, Au, Cr, Cu, Mo, NiCr, Pd, Pt, Ti, W < 0.5 um

pieces to 4 inch four 4 inch wafers Cont Precious metals limit is <200nm
  Intlvac_sputter SNF Supplied: Al, Co, Hf, Mo, Ni, Si(B), Ti, Zr
  Pieces to 4 inch
 4, four inch wafers
Clean, Semi-Clean
Can do reactive O2 and N2 sputtering

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