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ExFab (previously known as nSiL)

Ex Fab (previously known as nSiL) complements the resources available in the main SNF cleanroom. This new space allows researchers to integrate “bottom-up” synthetic chemical methods with the “top-down” device processing methods to create new nanostructure-based materials and devices. Specific areas of focus are the synthesis, functionalization, and manipulation of nanoparticles, nanostructures and surfaces.
PDS 2010 LABCOTER™ 2 Parylene Deposition System
A custom-built, dual-chamber N2 glovebox for sample preparation and spin-coating at reduced oxygen and moisture content. The left-side contains spin-coater and hot-plates, while the right one presently has a dual hot-plate/stirrer setup with stands for supporting glassware. Custom setups may be accommodated, with prior approval from staff.
Solidscape 3d Wax Printer
Equipment pages for the 3d wax printer, including printer description and operating procedures, wax mold post-processing, and maintenance.
Heidelberg MLA 150
The MLA150 is a high speed direct write lithography tool extended by capabilities formerly only available on Mask Aligners. It can expose the patterns directly without prior fabrication of a mask resulting in a significantly shorter prototyping cycle. It offers topside alignment and backside alignment with high accuracy, and a light source which generates sufficient dose to expose even thick and less sensitive resists. The sample size range allowed on MLA150 are 5mmX5mm to 150mmX150mm and allowed thickness range from 100um - 6mm. MLA 150 provides for flexible change of pattern, distortion compensation and other software corrections. For backside alignment, the substrate needs to be big enough that the alignment marks can be seen through the slots on the chuck. Please refer to the chuck dimensions on page 69 of the user guide attached below. Currently, the exposure wavelength is 405nm in the tool. Please use resists that can be exposed at 405nm or higher wavelengths. Please contact Swaroop Kommera if you have any questions regarding the substrates or resists that can be used. The system can produce structures down to 1 µm. The alignment accuracy can be as good as 250 nm under optimized conditions.
Finetech Lambda Flipchip bonder
FINEPLACER® lambda is a flexible sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, universities, prototyping and low-volume production.The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/photo diode bonding (glueing, curing) and the multi-stage assembly of opto electro mechanical systems (i.e. MEMS/MOEMS) for communications and medical technology products.
Lesker - Sputter
AJA Evaporator
Raith Ebeam Lithography tool
State-of-the-Art High Resolution Low Voltage Electron Beam Lithography and Metrology tool. Suitable for the research and development of Nanolithographic structures for micro and nano-Electronic, MEMS, Photonic, Plasmonic, and Integrated Optical Devices. * Direct Write E-beam exposure for chips and wafers to 150 mm diameter. * Ultimate resolution specified to 20 nm guaranteed with sub-10 - 15 nm features possible. * Accurate Write Field to Write Field Stitching and Layer 1 to Layer 2 Overlay specified to <40 nm with sub-20 nm typical. (mean + 3sigma values) * Ultra high resolution, low voltage SEM inspection with Ultra-high efficiency SE detectors with both In-lens and normal SE detection mode. *Laser Interferometer Stage w/ 2 nm resolution integrated to an advanced sample navigation and metrology software package. *Operates between 0.3 and 30 keV with user selectable Apertures to control Beam Current. * 10 MHz ELPHY PLUS FE pattern generator. * NanoPECS Proximity Effect Correction Software. *Digital SEM imaging with 1 - 2 nm resolution at most acceleration voltages.
DISCO Wafer Saw
Wbexfab_solv, Wbexfab_solv-plug
This is information for use of Wbexfab_solv, Wbexfab_solv-plug and Headway 3.
Headway 3
This is an instruction manual for Headway 3. The Headway Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate and fluid properties determine the final thickness of the film.
YES Oven 2
This is a manual for YES oven 2
Malvern Zetasizer DLS
The Malvern Zetasizer uses light scattering to evaluate nanoparticle sizes from 0.3nm to 10um in diameter. This system is also equipped with the capability to evaluate zeta potential of flat surfaces as well as particles.
Thinky Mixer
The Thinky AR-100 is a non-vacuum planetary centrifugal mixer. It is used for mixing and deaeration- some common uses are for PDMS mixing and battery slurry generation. Please contact Michelle Rincon (mmrincon at stanford dot edu) for more information.
The Cytoviva is a hyperspectral imaging instrument which allows spectral mapping of individual pixels on a microscope image. Please contact Michelle Rincon (mmrincon at stanford dot edu) for more information.
Jasco UV-Vis-NIR
The Jasco UV-Vis-NIR spectrophotometer is capable of evaluating the reflectance and absorbance characteristics of a sample. This Jasco V-670 operates in the wavelength range of 190-3200nm. Please contact Michelle Rincon (mmrincon at stanford dot edu) for more information.
Ultron Tape Mounter
The Aerosol Jet (AJ) 300 system provides the ability to print fine-feature patterns onto variety of substrates, with feature sizes as small as 10 um. The printing process is non-contact and conformal. During the AJ printing process, liquid-source ink is atomized into droplets ranging from 1 to 5 um in diameter. The droplets are entrained in a gas stream and directed into the print head where an annular flow of gas compresses the aerosol stream to a diameter as small as 10 um. The jet of aerosol droplets exits the print head at high velocity and is deposited onto the target substrate. The atomizer may be used for inks having a viscosity in the range of approximately 1 to 1000 cP. Please contact Swaroop Kommera (skommera at stanford dot edu) if you would like to learn more.
Nanoscribe Photonics Professional GT
Nanoscribe Photonics Professional GT is a versatile tool to write 3D micro and nano structures for applications in micro-fluidics, optics, bio-engineering, MEMS structures etc. Almost arbitrary complex 3D shapes (importable in STL file format) can be fabricated in the size range of a few hundred nanometers with a 2 photon polymerization or exposure process. It has both piezo and galvo scanning capabilities for ultra-precision and speed. The fabricated micro-structures in a polymeric material or photo-resist can also be used as a mold for making structures in other materials using PVD, CVD, ALD and electro-deposition for example. Please contact Swaroop Kommera at skommera at stanford dot edu for more details and for scheduling training.
Micromist Coater
Micromist coater is a research grade mini electrospray tool. It can be used to blanket coat material onto a substrate with minimal wastage of the material. It can also coat highly conformal films on substrate with high aspect ratio structures. The thickness per pass can be as low as 100nm (depending on the material sprayed) and films with good thickness variation can be coated with thicknesses > 1um. Please contact Swaroop Kommera at skommera at stanford dot edu for more information or training.
Alveole Primo
Alveole Primo allows precise and rapid way to pattern proteins. This tool uses UV laser (375nm) which is used to illuminate your pattern onto the substrate. A photoactive reagent PLPP with the UV illumination enables creation of the pattern. Proteins can then selectively adhere into the desired pattern. The minimum resolution of this tool is about 1.5um. Please contact Swaroop Kommera (skommera at stanford dot edu) or Gaspard Pardon (gaspard at stanford dot edu) for more information or for training on this tool.
Asylum AFM with environmental control chamber
Sinton Lifetime Tester
Sinton lifetime tester WCT-100 is used to test minority carrier lifetime at a specified minority carrier density. Please contact Swaroop Kommera (skommera at stanford dot edu) for more details and for training.
DISCO Backgrinder
DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducability is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.

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