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DISCO Backgrinder

DISCO Backgrinder can be used for precision removal of Silicon, compound semiconductors, packaging resin, copper-posts and other metals, Lithium Tantalate, Lithium Niobate, Sapphire and many other materials. This tool can process sample pieces to 8 inch wafers. Reproducability is less than 1.5um across an 8 inch surface and surface roughness possible is better than 150nm.

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