EV Group Contact Aligner
The Electronic Visions system is comprised of the precision optical 620 Aligner and the 501 Wafer Bonder. With the standard mask frame insert, the 620 Aligner module can perform precision mask-to-wafer front- or back-side alignment for near-UV photoresist exposure in any one of four modes (proximity, hard- and soft- contact, and vacuum contact.) With a specially provided bond tool, the 620 Aligner can perform proximity alignment of two wafers for processing in the 501 Bonder. Our current configuration accommodates 4" or 6" wafers and 5" or 7" masks.