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EV Glass to Si Alignment

Electronic Visions 620

Function Overview: Optical lithography contact/proximity aligner-bonder


  • 4 exposure modes: contact, vacuum contact, hard contact and proximity
  • frontside and backside alignment
  • 5X, 10X, and 20X objectives (100X total)
  • bonding chucks for anodic bonding, thermal compression bonding and fusion bonding.
  • minimum resolution in dark field = 1.0um line and <1um contacts
  • minimum resolution in clear field = 2um line and 2um contacts
  • 4" wafers, 5" masks 

Special Notes or Restrictions:

  • This machine allows most materials
  • See Materials section of our website for details
  • Clean front and back of mask before use
  • Clean mask every one to five wafers

Operating Procedures for Bonding Si to Glass

Startup Procedure

Change to bonding chuck

Change from mask holder to bond tool frame

Load first wafer and glass

Load second wafer

Shutdown Procedure

Button Reference Information

Special Notes


Startup

  • You need the thickness measurement on both wafers and they should have gone through megasonic clean.
  • Leave key ON
  • Enable "evalign"
  • You need to make sure that the chuck is centered as much as possible to the mask holder. You can start by putting the micrometers x, y, and theta to the mark we have made on the micrometers
  • Do not lean on the system at any time.
  • Click on icon ev620
  • OR if already there click on login and enter "620" for name and enter "620" for password.
  • -- initialization process begins (wec)
  • Follow instructions on screen (arrow indicates a machine instruction)
  • ->Move <tray out>
    • Change to Bonding Chuck
      • Use Clean gloves!
      • Remove vacuum line
      • Remove chuck and replace with bonding chuck (octagonal shaped vacuum pattern). Lift chuck out of frame from below.
      • Replace vacuum line
    • Double click on the process you want. These processes are standard processes so only change exposure time, alignment gap and other necessary changes. Do not save the changes..
    • Double click on the process you want. These processes are standard processes so only change exposure time, alignment gap and other necessary changes. Do not save the changes..
    • Change from Mask Holder to Bond Tool Frame
      • Use Clean gloves!
      • Lift mask holder out, watch out for the little blue o ring on the mask holder
      • Standard programs are: Top side align; bottom align; Si-Gl bond; Si-Si bond.

 

Process=Anodic Bond Mask Holder=5" Wafer=4"
Process Mode=normal  
Exposure mode=no exposure Exposure time=0
Contact Mode=normal Delay time=0
Proximity gap um=0 Interval= 0
Separation um=40  
  • Click "Run"
  • ->Save changes? NO (use them for your process only, do not change the program permanently)
  • ->Start> (initialization begins)
  • ->Insert Bondtool>
    • Insert Bond Tool into the holder with the writing "Bond Chuck Top" up and facing towards you.
    • Bond Tool - use clean gloves, do not touch chuck part. . (Separation flags may not be used, but if they are,  check that they will slide over a wafer without catching)
    • Goes in on top of bond tool frame.
    • Hold by feet and lower it in.
  • Press CONTINUE
  • Load the first wafer and bond glass
  • ->Load Top Wafer>
    • Load Bond Glass and the first wafer on the chuck using large ruler.
    • Position Bond Glass with writing up and on the right side ("top").
    • Load 1st wafer on the bond glass with the structured side down (first wafer is usually Si)
    • Position them up against the ruler (use large ruler for bonding) wafer flat side to the right
  • Press <CONTINUE> to fix wafer and Bond Glass (check that the vacuum is holding).
  • "PULL the flags out for first wafer " (no flags used)
  • Don't forget to remove ruler!
  • ->Move <TRAY IN>, (no flags used)
  • ->Check the flags,they must be out (confirm with continue).
  • ->Please wait>
  • ->Adjust microscope> to reach targets
    • Use Micrometer spindles (x axis, y axis and theta) to center the bond glass ( align to corner marks)
    • Press "Scan Optic" in the "Position-Menu" and you can move the microscopes with the joystick in x y and z direction (small motions give slower responses). For x and y push forward back or right or left, for focus rotate clockwise or counter clockwise.
    • To adjust for rotation use the micrometer screw ( since the wafer is not yet attached by vacuum)
    • Press "CONTINUE" when targets have been found and focused (to attach mask with vacuum)
  • ->Move <tray out> with bond glass.
  • Load second wafer on the bond glass with the structured side up.
  • Position them up against the ruler (use large ruler for bonding) wafer flat side to the right (with Glass wafer there is no flat, slide it under the ruler to center it..
  • Press <CONTINUE> to activate wafer vacuum, check vacuum
  • Don't forget to remove ruler
  • ->Move <tray in>
  • Move flags in
  • ->ADJUST STAGE>
    • Scan optic should be activated.
    • Note: the screen may go out of focus, just adjust it if this happens.
    • Use Micrometer spindles (x axis, y axis and theta) to center the bond glass ( align to corner marks)
    • Align second wafer (Glass to Si) using the 3 micrometer spindles (x axis, y axis and theta)
    • Press <CONTINUE>when ready with adjustment
  • Press <CONTINUE>
  • ->Press <CONTINUE> or separate/contact to go into CONTACT>
      Press "Sep/Cont" button to go in and out of contact to check alignment and re-adjust (contact has the light off button and separate has the light on).
    • When in contact, a "clamp wafer" command appears
    • When in separate, a "move contact" command appears
  • ->CLAMP WAFER>
    • When satisfied with alignment you should leave it in contact mode
    • Clamp the wafer by pressing down and rotating the two clamps.
    • The wafers will be pressed together. Because they are already in contact, you should not get any offset.
    • Press <CONTINUE> when wafer is clamped
  • ->Remove Bond Tool>
    • The whole bond tool can now be picked up and transported to the bonder for anodic bonding.
    • Press <CONTINUE>
  • ->Move <tray out>
  • ->Press CONTINUE> or EXIT>
    • Pressing continue will start the process again
    • Pressing exit will end the process
  • ->END OF PROCESS>

Shutdown Procedure

  • Change Chuck back to standard alignment chuck
  • Lift out Bond Tool Frame and replace mask holder
  • Select Park. Move tray in? Click on yes and move the tray in.
  • Leave key ON.
  • Leave PC Power on.
  • Click on Log off
  • Disable "evalign"
 
Button Information

 

Button Description
Limits Choose Scan Optic
Scan Optic

To move with the split field microscope. In addition you see the minimum, maximum and actual value of the left and the right microscope in X, Y and Z direction. With "Store Optic Pos" you can store the actual optic position. With "Load Optic Pos" you can load a stored optic position.

Recipe To set process data during the process
Controls To change the cross data and overlay intensity (in case of topside alignment you do not have a cross.)
continue Usually acknowledges previous choice or that what is on screen is done. Also may push <ENTER> button for same result (button with arrow down and to the left)
enter Confirms data entry
Track Ball Used for PC control
Joystick Adjust split field microscope in X and Y (right and left, forward and back)and to focus (rotate clockwise or counterclockwise). Speed controlled by slow or fast movements.
L/R: To change between left and right objective
Sep/Cont: To change between separation and contact
Undo: If you have a problem press "Undo" to go one process step back, and follow instructions on screen.
Stop: To stop the process
Exit: To leave the process
Wec Force: Check pressure during WEC only, cover weight can be adjusted.(0.4 barr)
Exposure Force:

Check pressure during align phase (0.5 barr).

Chuck Weight: Is actual pressure during WEC (270 -300 mbarr)
Hard Contact: When hard contact mode is selected you can adjust N2 pressure (0.5 barr)

 


Special Notes:

Lamp can not be restarted when key is turned on.

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