* 5:1 reducing stepper * Maximum die width = 18 mm; Maximum die height = 22.6 mm (actual maximum die is slightly smaller) * I-line (365 nm) * alignment accuracy of 60 nm. * Typical resolution to 0.45 microns * 5" reticle masks, 90 to 120 mil thick.
Updates and policy changes collectively decided (spearheaded by staff, input from community) are saved here.
A summary of the particle counts at various points in the lithography process.
This process describes how to combine your zero and first layer exposures in ASML and when you should consider this process.