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Oven 110ºC

This Oven bakes the wafers with resist at 110ºC after the development, called post-bake.

Picture and Location

 Oven 110

The tool is located at FG12 on the Lab Map.

 

Process Capabilities

Cleanliness Standard

 

The 110ºC Oven appears in all three equipment groups (clean, semiclean, and gold) as part of the litho & analytical tools set.

Performance of the Tool


This oven is the 110°C postbake oven. It is used to bake wafers after development.

 

How to Become a User

  1. "All Litho" is required before training on any of the lithography tools. Contact the trainers for the class schedule and training materials (which must be reviewed before the class).
  2. Read all material on the SNF website concerning this tool, including Background, Process Capabilities, Operating Procedures and Process Monitoring.
  3.  Contact SNF training contact on the Equipment Summary page.

 

Operating Procedures

This oven is the 110°C postbake oven. It is used to bake wafers after development.

25 minutes bake time in this oven is equal to 1 minute on a hotplate at 110°C.

It is used instead of the svgdev and svgdev2 hotplates if resist is on both sides of the wafers OR if you are beaker developing wafers and want to do a batch bake instead of one at a time on the hotplate.

 

 

Don’t change the temperature, it should be 110ºC.

The power stays on all the time, don't turn it off.

Check for maintenance signs. 

No reservation is necessary.

 

Use only the Teflon cassettes with one brown button! (Never use the plastic storage cassettes!)

There are 3“ and 4” Teflon cassettes in blue boxes on top of the wbmiscres.

Don't place the blue boxes in the oven.
  • Place the Teflon cassette in the oven and close the door.
Make sure the door is closed properly!
  • Leave wafers in the oven for 25 minutes, use your own timer, don't use the timer at the oven.
  • Remove the Teflon cassette using a heat resistant glove!
The Teflon cassette expands a little bit, it will not fit into the blue box right away. Place the cassette carefully in the box; the cassette will shrink within 2 to 3 minutes.
  • Close the oven door properly!

 

ADDITIONAL PROCESS INFO


Hotplate vs. oven:

On a hotplate, the substrate heats up first and then the portion of the resist closest to the wafer heats up next and begins to evaporate residual solvents and, finally, the topmost surface of the resist gets hot and evaporates the solvents within it.  As a result, there is a smooth evaporation of the solvents from the resist film.

In an oven, the outermost portion of the resists tends to heat first.  This tends to form a "skin" on the top surface of the resist that makes it more difficult for the solvent evaporating from the layers closer to the wafer from fully evaporating. 
In general, however, etch resistance and resist adhesion will be better with a longer, higher temperature post-development bake.

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