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Headway Manual Resist Spinner, headway2

The Headway Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate and fluid properties determine the final thickness of the film.

Picture and Location


This tool is located at FG23 on the Lab Map.


Process Capabilities

Cleanliness Standard

The headway2 appears in all three equipment groups (clean, semiclean, and gold) as part of the litho & analytical tools set.

Materials control policies are governed by equipment groups; for the description of this policy, click <here>.

Performance of the Tool

What the Tool CAN do

  • Allow manual dispensing of any SNF-acceptable photoresist
  • Adjustable spin speeds and spin time
  • 'Interchangeable vacuum chuck allows processing of wafer chips and substrates of unusual size or shape


Contact List and How to Become a User

Contact List

  • Process Staff: Mahnaz
  • Maintenance:  Mario/Gary
  • Super-Users:  none


Training to Become a Tool User

  1. "All Litho" is required before training on any of the lithography tools. Contact the trainers for the class schedule and training materials (which must be reviewed before the class). If no training hours are indicated, training for the tool is covered in the "All Litho" session.
  2.  Contact SNF training contact on the Equipment Summary page.


Operating Procedures


  • For procedures on manual coating, click <here>.
  • For procedure for manual developing, click <here>.
  • Manual Resist Coat
    • Shipley 3612
    • SPR220-7
    • LOL2000
    • Ebeam Resist - manual application
    • Any approved non-standard resists, polymers.


Special Notes or Restrictions

  • Pieces to 6 inch wafers
  • Check the MSDS sheets for hazard information on the photo-resist you are using and handle them with caution.
  • Read the list of rules for operating the Headway2 (these are the same as for wbmiscres).
  • Keep open containers at least 6 inches back from the front of the exhaust hood
  • Notify the staff immediately if resist smells are detected while working at the station.

Handling Personal Chemicals

Here is the short version for handling personal chemicals after SNF approval: 

  1. Get a yellow label (for personal chemicals). 
  2. Make sure you have all the information including the date filled in. If there is no date, we will dispose the chemical during shut down (no warning issued). 
  3. All non-standard chemicals should to be stored in the yellow flammable cabinet in the service area (behind furnaces).
  4. If you want to keep the chemical, get a new label with new date before shut down, otherwise will dispose during shut down (no warning issued).

Basic Operation Instructions

Initial Checks

  1. Enable "headway2"


Before Coating

  1. Vacuum check the system without a chuck. If it spins, write it up as a problem and do not use it (your wafers may fly off the chuck during the spin step).
  2. Select the appropriate chuck. Make sure it is clean and has an O-ring on the inside. Choose the correct size chuck for your wafers.
  3. Vacuum check the system with the selected chuck. If it spins, choose a different chuck or clean the one you have selected with Acetone.
  4. Set up the appropriate spin speed and time (see spin speed charts for each resist in the lithography information book) using a dummy wafer after centering it, Step on the front of the pedal to start the spin, and after the speed is set, step on the back of the pedal if you want to stop it before the time is up. Try it at least twice to make sure you have the correct  spin speed.
  5. Apply photoresist to your wafer. Step on the front of the pedal to start the spin. When the time is up it will stop spinning.
  6. Coating tips: If you notice some areas near the edge do not get covered with resist, it may be necessary to increase the time (typically 30 seconds) to 40 seconds and after applying the resist turn down the spin speed before you step on the pedal. Let the resist spread across the wafer and then increase the speed to the correct setting (just so the last 25 or 30 seconds is at the correct speed to get the desired thickness).
    • Could be simply you are not applying enough resist.
    • Please do not pour back any of the resist from beaker to the main bottle, this will  contaminate the whole bottle.
    • All the standard resists are kept in the yellow flammable cabinet next to the bench.
    • We have 3 different bottle versions of 3612,220-3 and 220-7, droplet bottles, medium size bottles and bigger ones.

The flammable cabinet in the litho area will only be for standard small bottles and spray coater resists. No other personal bottles should be stored at any time in the yellow cabinet next to headway. I strongly suggest that everyone follow the policy as we will dispose of any personal chemicals left in there. (No warning or email be issued).


Clean Up

  1. Always dispose of solvent contaminated items properly. Never bring solvent contaminated items out from under an exhaust hood unless they are in a closed zip-log bags ( your gloves can be used for small items). If your glove is contaminated (i.e. with photo-resist) turn it inside out to prevent fumes and touching the surface of the bench. Transfer all the contaminated items like, foil, wipes, gloves and q-tips to zip-log bag and dispose  it in to hazardous bin next to the tool.
  2. Disable "headway2"

You should find the tool clean before use and leave it clean for next user, please note all the issues on Badger.

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