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Laurell Manual Resist Spinner, laurell-R

The Laurell Coater is used to apply photoresist to any substrate. Centrifugal force uniformly spreads fluid across the surface of the spinning substrate. The spin speed, spin time, and substrate and fluid properties determine the final thickness of the film.

Picture and Location

Laurell wet bench 

This tool is located at FG23 on the Lab Map.


Process Capabilities

Cleanliness Standard

The laurell-R appears in all three equipment groups (clean, semiclean, and gold) as part of the litho & analytical tools set.
Materials control policies are governed by equipment groups; for the description of this policy, click <here>. 


Performance of the Tool

What the Tool CAN do

  • Allow manual dispensing of Shipley 3612, SPR220-7, SPR220-3, AZ5214IR and ebeam (PMAA 2% and 5% only) resists.
  • Adjustable spin speeds, spin time, ramps.
  • Interchangeable vacuum chuck allows processing of wafer chips and substrates of unusual size or shape up to 6".


What the Tool CANNOT do

  • Because of chemical incompatibility with other standard chemicals, polyimide,  LOL2000, SU-8 and Espacer  are NOT allowed on this system.


How to Become a User

  1. "All Litho" is required before training on any of the lithography tools. Contact the trainers for the class schedule and training materials (which must be reviewed before the class). If no training hours are indicated, training for the tool is covered in the "All Litho" session.
  2.  Contact SNF training contact on the Equipment Summary page.

Operating Procedures



  • Manual Resist Coat
    • Shipley 3612
    • SPR220-7 or 220-3
    • Ebeam Resist - manual application

Special Notes or Restrictions:

  • Pieces to 6 inch wafers
  • No polyimides, SU8, LOL2000 or Espacer (use the headway2 manual coater)
  • Check the MSDS sheets for hazard information on the photoresist you are using and handle them with caution.
  • Standard resists (3612, 220-3, 220-7  are available in small bottles in the flammable cabinet left of the bench. It is allowed to hand carry these small bottles from the small yellow cabinet to the Laurell bench only. All Ebeam resists are still in the yellow flammable cabinet in the back.
  • All the standard resists are kept in the yellow flammable cabinet next to the bench.
  • We have 3 different  bottle versions of 3612,220-3 and 220-7, droplet bottles, medium size bottles and bigger ones.
    The flammable cabinet in the litho area will only be for standard small bottles and spray coater resists.
    No other personal bottles should be stored at any time in the yellow cabinet next to headway.
    I strongly suggest that everyone follow the policy as we will dispose of any personal chemicals left in there. (No warning or email be issued).

    Here is the short version for handling personal chemicals after SNF approval:
    1-Get a yellow label (for personal chemicals).
    2-Make sure you have all the information including the date filled in.
    3- No date, will dispose the chemical during shut down ( no warning issued).
    4-All non standard chemicals should to be stored in the yellow flammable cabinet in the service area (behind furnaces).
    5-Want to keep the chemical, get a new label with new date before shut down, otherwise will dispose during shut down (no warning issued).
  • Pouring resist from a big bottle to a small container is only allowed under the litho solvent wet bench. Cover all open containers with foil, label them with a blue card and transfer them using a metal cart.
  • Never pour back left over resist in small containers back to main bottles, will cause contamination.
  • Keep open containers at least 6 inches back from the front of the exhaust hood
  • Notify the staff immediately if resist smells are detected while working at the station.

Operating Procedures:

1.     Enable "laurell-R"


2. Before Coating:
      • The system has two modes: off and program mode
      • Off mode: to run the system
      • Program (pgm) mode: to program the steps of your recipe
      • Press F1 to get PGM on the screen
      • Press PROGRAM SELECT to get the desired program
        • From top left - Mode (RUN,END,PGM,OFF); Vacuum Indicator; Program (A-Z)
        • Heading line
        • Setpoint time; Setpoint rpm; Pilot Valves 1-4 (0 indicates valve is off)
        • Actual time; Actual rpm; Pilot Valves 5-8 (0 indicates valve is off)

    • Check the selected programs are correct to use
      • Verify that each step is correct
      • Press STEP to move through the steps of the program (on the screen you will see 001/003 which indicates which step you are on of the total number of steps in the program -- i.e. step 001 of 003 steps)
    • How to edit the incorrect step, or set up a separate program
      • Choose any program you like by pressing F1
        • NOTE: Entering values that exceed the capability of the motor will cause overshoots of the setpoint speeds and damage the motor.
        • Deceleration values should not exceed 1000 RPM/sec; Acceleration values in excess of 2000 RPM/sec are probably not achievable.
      • Press up or down arrows to change the the value
      • Press right or left arrows to change to a different step of the program
      • Press ADD STEP or DEL STEP to add or delete a step
      • The first step should start with 300 rpm, for “time” give yourself enough time like 15 – 30 seconds. This step is to check the system as well as applying the resist.
      • You need to use 300 rpm for last step as well.

3. Coat your wafers

    • Press F1 to change PGM to OFF (exits program mode). This must be done or program will only run the step is on  so make sure to switch to OFF.
    • Open the cover
    • Load a dummy wafer or your sample and press vacuum. Check to see if vacuum is holding and vacuum pressure seems normal (~22 inches of HG +/_ 2).
    • Close the cover
    • Push RUN/STOP button to start the program, this will check the system.
    • Dispense resist through the hole in the cover.
    • Due to a double exhaust system, you need to cover the hole with a wipe, wafer, or your hand immediately before you go to high speed. This will improve the uniformity of the sample.
    • When the program is finished, unload the dummy and begin your real wafers

4.     CLEAN UP

Please note not to use acetone while any wafers are on the hot plate.

a.     Use a dummy wafer and squirt with acetone to clean system completely on the inside, and wipe down the outside with acetone on a clean wipe.

b.     Dispose of items contaminated with resist or Acetone in a zip log bag and place the bag in the hazardous waste container next to the bench.

c.     If necessary, take the chuck to the solvent bench, clean it with Acetone, Methanol, and Isopropanol, blow dry it, and return it to the box at the Laurell bench.

d.     You should always find the system clean and leave it clean for the next labuser.

  1. Disable "laurell-R"


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