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Wafer Bonding, Sawing & Polishing

GnP POLI-400L: cmp
The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surface, as well as, to smooth surface roughness.
EV Group Wafer Bonder: evbond
Suss Wafer Bonder: ksbond
Benchtop Muffle Furnace: thermolyne
K&S 775 Wafer Dicing Saw: wafersaw
DISCO Wafer Saw

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