Wafer Bonding, Sawing & Polishing
- GnP POLI-400L: cmp
- The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surface, as well as, to smooth surface roughness.
- EV Group Wafer Bonder: evbond
- Suss Wafer Bonder: ksbond
- Benchtop Muffle Furnace: thermolyne
- K&S 775 Wafer Dicing Saw: wafersaw