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GnP POLI-400L: cmp

The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surface, as well as, to smooth surface roughness.
CMP
The POLI-400L CMP (Chemical Mechanical Polishing) system is designed to polish standard 4” wafers (no pieces). CMP is often used to polish wafers, to planarize patterned surface, as well as, to smooth surface roughness.
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