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DISCO Wafersaw Operating Procedure

DISCO Wafer Saw - DAD3240 - Capable of cutting silicon, glass and quartz substrates up to 8" circles. Belongs to the flexible / contaminated group of equipment.

Picture and Location

 

DAD3420.JPG 

 The DISCO DAD3240 wafer dicing saw is located in the utility room across from the SNF stockroom.  Access to this utility room is limited to staff and qualified labmembers.

Background

 

Process Capabilities

Cleanliness Standard: Flexible/ Contaminated

Performance of the Tool:

What the Tool CAN do

  • Dice Si, glass, quartz and bonded wafers.
  • Note that blade requirements are different for different substrates.

Blade Schedule:

  • Monday 2PM - Thursday 2PM:  Resin blade - ADT resin blade - 00777-1030-010-QIP - 3mm Exposure - For cutting glass, quartz and bonded substrates
  • Thursday 2PM - Monday 2PM - Hub blade - K& S F3530 - 0.8mm Exposure - for cutting Si wafers.
  • If any other blade is needed, contact one of the members of tool quality circle for installing the required blade.

What the Tool CANNOT do

  • Using wrong blade for the substrate will cause blade breakage or excessive wear.  
Process Monitoring

 

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

  • Process Staff:  Usha Raghuram & Mary Tang
  • Maintenance: Elmer Enriquez, Gary Sosa & Ted Berg
  • Super-Users: Jeff Hill, Andrew Ceballos, Stefan Zappe, Stephanie Nitopi and Dale Li

Training to Become a Tool User

Off Hour room access code: 5314

DISCO DAD3240 Operation

Wafer Preparation:

  • Protect front side/ device side of the wafer by coating with photoresist.
  • Attach dicing tape to the dicing ring.
  • Place wafer on the dicing tape in the middle of the dicing ring such that the flat area is away from the notches on the ring.
  • If the wafer is placed with flat away from notch in the dicing ring, then channel 1 is parallel to the flat and channel 2 is perpendicular.
  • The tape should stick to the backside of the wafer and the backside of the ring.
  • Remove any big air bubbles.
  • If cutting small pieces, after dicing the diced pieces may come off the tape.  To improve adhesion UV release tape can be used.  

Short Procedure (Cut Chart Menu)

Equipment Setup: 

  • Enable tool in badger.
  • Ensure breaker on the back of the tool is on.
  • Turn on the main power by turning the "Power" key toward "Start" position and releasing it to the "On" position. 
  • Ensure air is on by checking the digital gauge on the main screen.
  • During operation pay attention to the message line as the message line will prompt for the next action to enable the continuation of the operation in many cases.
  • Follow the cut chart menu for the sequence of operations (Figure A)

Figure A 

  • Initialize the system.
  • Make sure chuck vacuum is off.
  • Load the dicing ring with the wafer on to the chuck table.
  • Turn on the chuck vacuum.
  • Warm up system – Turn the spindle on.
  • Turn on the "Cutting Water" and set the water level for the blade and shower to 1 lt/min and turn it off.  Note: Water comes on during cutting operation automatically.  
  • Set up/ verify device data.
  • Choose directory & device data file.
  • Verify device data, make changes as needed and save changes by pressing “Enter”.
  • Exit out of device data screen by pressing “Exit”
  • The device data file name will be displayed at the bottom right corner of the menu.
  • Choose blade set up; Blade set up menu (Figure B) will pop up with the Non-Contact Setup option. 

 Figure B

  • Make sure the correct blade information is displayed.  If not call maintenance to load the correct information.
  • Execute blade setup by pressing start– Only non-contact set up is required if the chuck table is not changed.
  • When done, press exit.

 Cut Wafer:

  • In step 5 (Figure A), choose the “AutoCut” / "Semi-Auto-Cut" option as needed.  
  • Semi auto cut will cut one channel all the way through from the alignment position and auto cut will cut both the channels.
  • “F6” function at the bottom of the screen toggles between Auto and Semi-Auto cut options.
  • Choose “Manual Align” from Step 5.
    • Adjust light intensity & microscope focus.
    • Perform q alignment for channel 1.
    • Execute street adjustment.
    • Perform q alignment for channel 2 (for auto-cut option).
    • Execute street adjustment (for auto-cut option).
  • Perform auto cut/ semi auto cut by pressing the start button on top.
  • Note that if semi autocut option is chosen, cut direction needs to be chosen.
  • Stop after 1st cut and adjust for cutting position to apply correction.
    • Adjust hairline if needed.
      • Adjust light intensity and microscope focus.
      • Center the hairline in the kerf. 
      • Choose hairline adjust command. 
      • Press stop correction button.
    • Adjust cut position if the cut needs to be centered within the street.
      • Center the center of hairline to the center of the street.
      • Press adjust cut position.
  • Press start button to resume cutting.
  • Note:  Anytime during the operation “Stop” button can be pressed.  This will stop the cut after completing the cut. 
  • In order to stop the cutting right away, press the Z-EM button on top.  This will raise the blade up and stop the cut.

Process Termination:

  • After the completion of cutting, let the spindle run free for ~30 seconds.
  • Run non-contact setup for the blade to calibrate the blade wear and exposure.
  • Press cutting water button on and let it run for ~20 seconds and then turn it off.
  • Let spindle run for another minute or so with water off.
  • Press system initial button.
  • Verify that coolant water and spindle are off.
  • Turn off chuck vacuum.
  • Remove the dicing ring with the cut wafer.
  • Clean the water case.
  • Turn power off.

 

 Device Data Set Up

  • From the cut chart menu click on "Device Data" icon to get the device data list menu (Figure I).
  • To create a new device data file, create a new file by copying an existing file and modifying it.  
Figure I.jpg

 

  • Choose the copy command (F2) from the command bar at the bottom.
  • This brings up the copy screen with source file location on top and destination file information at the bottom (Figure II).
Figure II.jpg
  • Choose the file for source file by highlighting the directory and file name to to be copied.
  • Choose the destination directory and type in the destination file name in the "Destination Data" tab and press "Enter"
  • A new file under the name given is then created in the chosen directory.  Click on "Exit" to get out of the copy mode.
  • From the "Device Data List" screen (Figure I), highlight the recipe of interest and press "Enter".
  • This will open up the device data advanced screen (Figure III).
 Figure III.jpg
  • Table I gives description of parameters and allowed/ recommended settings for each of the parameters.
  • Index parameters can be updated based on actual measurements on wafer.
  • Click on "Measure" (F10) button from the "Cutting Data" to access the measurement screen

Table I:  Description of Variable in Device Data

Field Name Description
ID Device data ID - 30 characters maximum
Round/ Square Work piece (wafer) shape - round or rectangle
For round substrates, specify wafer diameter
For square /rectangular substrates, specify x (channel 1) and Y (channel 2) dimensions
Work Thickness Thickness of work piece/ substrate/ wafer
Tape thickness Thickness of the tape underneath the work piece
Cutting Channel Direction of cut.  For example, to make rectanglular dies, the cut has to be in 2 directions (x and y) that are at 90 degree angles from one another
q Angle Rotation angle of each channel relative to initial position
Cut mode  A- Down cut; Cutting while chuck table is moving from right to left
A_UP - Up cut; cutting while chuck table is moving from left to right
B - Repition of A and A_up cuts
B-ZKEEP - Identical to B without Z-direction escape during indexing
Cut Direction Rear - from front to rear of the work piece
Front - From rear to front of work piece
Cut Line  No of lines to be cut;.
"0" - will calculate the number of lines that needed to be cut based on the work piece size, index value and specified exclusions
Align Cutting is performed at the position shifted by the entered distance from the street adjusted position
Noncut F Distance to be left uncut in the front
Noncut R Distance to be left uncut in the rear
Offset-l X-Axis Offset in the funcion select screen (F4) should be yes.  - Offset between chuck table center and work piece; work piece center to the right of chuck table center is a positive offset.
Offset-q Applicable only if the cut start position has to be offset as cut progresses
Spindle speed Spindle revoluion - 6000-60000 rpm; Typical for Si work piece: 30,000rpm; for glass substrtes ~20,000 rpm
Precut Process Precut process to be used
Cutting Ch. Seq Sequence in which cuts will be made along different channels; 1234, 4321; 12, 21, etc.
Change Unit Toggles measurements between mm or inch scale.
Sequence Sequence of cuts for each channel; each sequence can have a different index, blade height and feed rate
Blade height Distance between the chucktable ad blade tip; Corresponds to thethickness left uncut; should not enter any number below 50um (0.05mm)
Feed speed Speed at which chuck table moves; mm/sec
Index Distance between cuts in the same direction.
Depth Steps For multi-level cutting; each time, the blade enters the work piece to a specified depth (cut depth).  Cuts are reeated until the blade height limit is reached.
Repeat lines Related to no of repeats for each sequence before the next sequence (refer to Figure IV).

 

Blade & Other recommended settings:

 

Recommended blade, tape and settings (Device data) for the following parameters:

Note:  for all wafer/ substrate types:  Blade Height should be >0.05mm (50um)

1.        Si wafer  ~ 0.5-0.675mm thick –

a.       K & S Hub blade in stock (0.8mm exposure)

b.      80-100um kerf

c.       Tape: Blue tape

d.      Spindle speed – 30,000 rpm

e.      Feed rate: 5mm-20mm

2.       Glass wafers – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure

b.       kerf -250-300um

c.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

d.       Spindle speed – 20,000rpm

e.      Feed rate = 2-5 mm/sec

f.      For substrates >1mm thick, do 2 pass cut.

3.       Quartz wafers – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure; kerf - 250-300um

b.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

c.       Spindle speed – 20,000rpm

d.      Feed rate = 0.5-2 mm/sec

e.      For substrates >1mm thick, do 2 pass cut.

4.       Bonded wafers (Si and glass) – 0.5mm – 1mm thick

a.       ADT resin blade in stock- ~3mm exposure; kerf -250-300um

b.      Tape – UV tape recommended (150-170um); blue tape is acceptable, but, pieces may not stick very well.  Use caution when using blue tape.

c.       Spindle speed – 30,000rpm

d.      Feed rate = 2-5 mm/sec

e.      For substrates >1mm thick, do 2 pass cut.

 

Operating Procedure (Layer Menu)

Equipment Set Up:

 

  • Enable tool in badger.
  • Ensure breaker in the back of the tool is on (Figure 1).    

 

Figure 1

Figure 2

  • Turn on the main power (Figure 2).  Note that it may take a minute or so for booting.
  • During operation pay attention to the information bar as the message line (Figure 3) will prompt for the next action to enable the continuation of the operation in many cases.

 

Figure 3

  • When “Initialize system” message appears in the message line, initialize the system by pressing the “System Initial” button from the software keyboard area (Figure 3).
  • Once the system initialization is completed, turn off the chuck vacuum by pressing the “C/T Vacuum” button in the software keyboard area (Figure 3).
  • Load the dicing ring with the wafer on to the chuck table (Figure 4).  The notches in the dicing ring should align with the pins on the chuck table.  Use caution when loading the dicing ring as it is very easy to get your fingers caught in the middle.

 

Figure 4

  • Turn on the chuck vacuum by pressing “C/T vacuum button (Main Menu).
  • Choose the correct blade (if the blade is changed) from the used/ new blade list from the Blade Maintenance Menu (Figure 5).  Refer to Blade Specifications and Blade Change Procedure  for changing blade and blade set up. 

 

Figure 5a

Figure 5b

  • Warm up system – Turn on the “Spindle” and “Cutting Water” either from the Main Menu or Blade Maintenance Menu (Figures 3 or 5a).
  • Check air gauge (Main Air) and chuck vacuum gauge are green (Air pressure >0.35MPa; Cuck vacuum below -65kPa) and the shower and blade water levels are ~1lt/min (Fig 5b).  Note: Water comes on during cutting operation or when turned on using the cutting water on button.
  • Choose “Non-Contact Set Up” from blade set up screen and press the “Start” button (Figure 6) – Only non-contact set up should be performed if the chuck table is not changed.

 

Figure 6

  • Once the Non-Contact Set Up is completed, “Exit” out of the Blade Set Up page by pressing the Exit button.
  • If “Non-Contact Set UP” failed, “Sensor Cleaning” may be needed.  Contact maintenance.
  • Verify that the blade exposure is in the desirable range.  Exposure should be at least 0.05mm more than the wafer + tape thickness.
  • Set up/ verify device data (Refer to Section 3 for instructions).
  • Make sure that the work thickness + tape thickness reflects the actual wafer thickness + tape thickness and the wafer size is correct.
  • Choose directory & device data file from the “Device Data” list (Figure 7)
  • Press F10 – Registration button. Then, device data file name will be displayed in the main menu.

 

Figure 7 

Cut Wafer: 

 

  • From Main Menu, choose “Manual Operation” (Figure 8).
  • Go to “Manual Alignment” screen (Figure 9) by choosing “F2” from “Manual Operation” screen.

 

Figure 8 

Figure 9

  • Adjust light intensity & microscope focus using F8 and F9 keys.

Figures 9a & 9b

  • Light Level Adjustment Screen (Figure 9a).
    •  Use “F5” (auto light key) or the increase/ decrease buttons.  Press exit when done.
  • Focus Adjustment (Figure 9b).
    • Use F9 button (auto focus) or use up and down arrows to focus on the sample.
    • The number displayed in the main area under focus adjustment will roughly correspond to the tape + sample thickness measured and recorded in the “Device Data” file.
    • Press Exit when done.
  • The next step is to perform theta  alignment.
    • Stage can be moved around to find a location on the wafer either by using the left, right, top or bottom arrows to the right of the main picture area. 
    • Or, the wafer stage can be moved by pressing any point on the main picture area.  The point that is chosen will move to the center of the picture frame.
    • Find a street on the left side of the wafer and align the dotted lines along with street edges by using narrow/ widen hairline functions and moving the stage. 
    • Press “F5” (Align q).
    • The stage will move to the right.
    • Find the same street and align the dotted lines to the street by using up/ down arrows. 
    • Press “Align q” once again.  Note that the final movement has to be through the up arrow.
  •  From the “Manual Operation” menu (Figure 8), choose “Auto Cut” or “Semi-auto Cut” (Figures 10a & b).

 

 Figure 10a

 Figure 10b

  •  Choose “F4” for manual alignment.   
    • Align ‘q” once again for channel 1. 
    • System will prompt you to do street alignment for channel 1.
    • If semi-auto cut is chosen, once street alignment is done, cut direction (front, “F2” or rear “F1”) should be chosen and then, the cutting can be started by pressing the Start button.
    • If “Auto-Cut” is chosen, wafer will rotate to channel 2 and both “q” alignment and street alignment should be done for the 2nd channel.
  • Then, “Start” can be pressed for the start of cutting.
    • Note that during Semi-Auto cut, only one channel will be cut from the 1st street identified in the direction specified.
    • With Auto-Cut, both channels will be cut.
  • Stop after 1st cut and adjust for cutting position to apply correction (Figure 11).
    • Adjust light intensity and microscope focus.
    • Center the hairline in the kerf. 
    • Choose hairline adjust command (F5). 
    • Press stop correction button.
  • Adjust cut position if needed.
    • If the cut needs to be centered within the street
    • Press stop cut if cutting is in progress.
    • Adjust light intensity and microscope focus if needed.
    • Press stop correction button to get out of the hairline adjust mode.
    • Center the center of hairline to the center of the street
    • Press adjust cut position(F11).
 

Figure 11

  • Press start button to resume cutting.

 

Process Termination:

 

 

  • After completion of cutting, let the spindle run free for ~2-3 min.
  • Press cutting water button to turn it off.
  • Let spindle run for ~2-3min with water off.
  • Press system initial button.
  • Verify that coolant water and spindle are off.
  • Clean the water case. 

 

 

Process Monitoring and Machine Qualification

Tool Qualification Run

 

Frequency

 

Procedure

 

Responsibility

 

 

Recommendation to users with critical processes

 

Machine Status States

Red:

Yellow:

Green:

 

Process Monitoring Results

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