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Wet Bench Decon and Clean-3

wbdecon and wbclean-3

This bench has two units. The left side, wbdecon, has one HCl bath, dump rinser, and SRD for the decontamination of 3", 4" or 6 " KOH-etched silicon wafers before being allowed back into the clean equipment group. The right side of the bench, wbclean-3, has four bath: the chemical baths are: SC1 (5:1:1 H2O:H2O2:NH4OH for removal of trace organics) and SC2 (5:1:1 H2O:H2O2:HCl for removal of trace metal ions), 50:1 HF, for oxide etching and 6:1 BOE for oxide etching.

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