Skip to content. | Skip to navigation

• SNF Directory
• Site Map
• Accessibility
• Contact

Sections

• Home
• Equipment
  • Up to date Equipment Summary
  • Equipment Summary
  • Beam Tools
    • Hummer V Sputter Coater: hummer
    • Raith 150 Ebeam Writer: RAITH
  • Optical Photolithography Overview
    • Resist Coat, Tool Summary
      • Headway
      • Laurell
      • SVG Coat Tracks 1&2
      • EVG 101 Spray coater
    • Exposure Tool Summary
      • ASML
      • KarlSuss Aligner
      • EV Group Contact Aligner
    • Develop Summary
      • SVG Developer
    • Oven Bake & Cure Summary
      • YES Oven
      • Oven 110C
      • Oven 90C
      • Singe Oven 150C
  • Chemical Vapor Deposition
    • Low Pressure CVD
      • Teos2
      • ThermcoNitride
      • ThermcoLTO
      • TylanNitride
      • TylanBPSG
      • LPCVD tests
      • Thermcopoly
      • Thermcopoly2
      • CVD-graphene
      • CVD-nanotube
    • PECVD
      • PlasmaTherm Versaline HDPCVD
      • PlasmaTherm CCP-Dep
      • STS PECVD Tool
    • ALD
      • Savannah
      • Fiji1
      • Fiji2
      • Fiji3
      • MVD
      • Available Films at SNF
      • EE412 Final Reports
      • ALD Tutorials
      • ALD Images
      • Savannah semi-clean contamination category policy
    • Epi2 (Chamber A)
    • Epi papers/images
      • Sidewall epitaxial piezoresistor process and characterisation for in-plane force sensing applications
      • Room temperature 1.6 μm electroluminescence from Ge light emitting diode on Si substrate
      • Effects of hydrogen annealing on heteroepitaxial-Ge layers on Si: Surface roughness and electrical quality
      • Ge on Si by Novel Heteroepitaxy for High Efficiency Near Infrared Photodetection
      • Fabrication of High-Quality p-MOSFET in Ge Grown Heteroepitaxially on Si
      • High-efficiency metal–semiconductor–metal photodetectors on heteroepitaxially grown Ge on Si
      • Defect Reduction of Ge on Si by Selective Epitaxy and Hydrogen Annealing
      • Low-Temperature, LPCVD and Solid Phase Crystallization of Silicon–Germanium Films
      • Effect of Isochronal Hydrogen Annealing on Surface Roughness and Threading Dislocation Density of Epitaxial Ge on Si
      • Germanium In Situ Doped Epitaxial Growth on Si for High-Performance n+/p Junction Diode
      • Germanium In Situ Doped Epitaxial Growth on Si for High-Performance n+/p-Junction Diode
      • High-Efficiency p-i-n Photodetectors on Selective-Area-Grown Ge for Monolithic Integration
      • High Performance n-MOSFETs with Novel Source/Drain on Selectively Grown Ge on Si for Monolithic Integration
      • Effect of isochronal hydrogen annealing on surface roughness and threading dislocation density of epitaxial Ge films grown on Si
      • Low Temperature Germanium Growth on Silicon Oxide Using Boron Seed Layer and In Situ Dopant Activation
    • Epi2B (Chamber B)
    • MOCVD
      • aix200
      • aix-ccs
      • SNF MOCVD lab capability introduction
  • Metalization & Sputtering
    • Evaporation
      • IntlVac Nanochrome I Evaporator, intlvac_evap, Automatic
      • Innotec ES26C E-Beam Evaporator
      • AJA-evaporator
    • Sputtering
      • Metalica Sputter System
      • Sputtering Papers
      • Intlvac NanoChrome 1 Sputter
      • Lesker-Sputter
  • Dry Etching
    • Table and Overview of available etchers at SNF
    • General Information on Plasma Etching
      • Overview of Etchers Available at SNF
      • How to Attach Samples to Carrier Wafers for Plasma Etching or Deposition
      • Etch Equipment Trobleshooting Guide
    • AMT 8100 Plasma Etcher, amtetcher (semi-clean)
      • AMT page, new wiki site
      • AMT 8100 Plasma Etcher, amtetcher
      • Amtetcher Quick Start
      • Standard Recipes and Etch Rates
      • NEW! Recent qualification Results
      • Non-Standard and Lesser Used Recipes
      • 200 nm Structures using Amtetcher
      • Fine Example of RF arcing
    • Drytek2 Model 100, drytek2 (semiclean)
      • Drytek 2 page, new wiki site
      • Drytek2 Model 100, drytek2
      • Drytek2 Quick Start Instructions
      • Standard Recipes and Etch Rates for Drytek2
      • Recent Process Qualifications
      • Procedure for Balancing RF Power to Electrodes
    • Drytek4 Model 100 (modified), drytek4 (contaminated)
      • Drytek4 Model 100 (modified), drytek4
      • Etch Rates and Selectivities
    • Gasonics Aura Plasma Asher, gasonics (semi-clean)
      • Gasonics Plasma Asher
    • Lam Research 9400 TCP Poly Etcher, lampoly (clean)
      • lampoly page, new site
      • Lampoly Operating Procedure
      • Clarycon Website
      • Etch Profiles
      • Isotropic silicon etching
      • Semiclean Wafers on lampoly/p5000etch Poly
      • Anistropic Etching of Single-Crystal Silicon
      • Images
    • Matrix Plasma Asher, matrix (contaminated)
      • Matrix, new site
      • Matrix Plasma Asher, matrix
    • MRC Model 55 RIE, mrc (contaminated)
      • MRC, new site
      • MRC Model 55 RIE, mrc
      • Quick Start for MRC
      • Selected Recipes
      • Qual results
      • Using the Pirani Gauge on the MRC
    • Applied Materials Precision 5000 Etcher, p5000etch (semi-clean)
      • P5000, new wiki page
      • Applied Materials Precision 5000 Etcher, p5000etch
      • Quick Start for P5000etch
      • NEW! Recent Process Qualifications
      • Endpoint Wavelengths
    • Plasma Quest ECR Etcher, pquest (contaminated)
      • Plasma Quest ECR Etcher, pquest
      • PQuest Chemistry Calendar
    • STS Deep RIE Etcher, stsetch (semi-clean)
      • stsetch, new wiki page
      • STS Deep RIE Etcher, stsetch
      • Quick Start for Stsetch
      • SEM Images of Selected Process Qualification Wafers
      • Description of Wafer Holder
      • Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher
      • Effect of wafer holder on etch profiles & grass
      • STS Deep RIE Etcher- Studies
    • STS HRM Deep RIE Etcher, stsetch2 (semi-clean)
      • STS HRM Deep RIE Etcher, stsetch2
      • STS II Response Table
      • Throttle vs Pressure for SF6 and C4F8
      • STSetch2 etch profile
      • How to Improve Etch Profiles Using stsetch2
      • Characterization
      • Crystalbond Procedure
    • Xactix
      • Xactix: A XeF2 dry, chemical etcher
    • Oxford III-V Etcher
      • ox-35, new wiki page
      • Operating Instructions- Ox-35
      • Characterization
    • Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl)
      • Plasma Therm Etchers - General Operating Procedure
      • PlasmaTherm Metal Etcher (pt-mtl)
      • PlasmaTherm Oxide Etcher (pt-ox)
      • PlasmaTherm Deep Silicon Etcher (pt-dse)
      • PlasmaTherm - Creating/ Editing Recipes
      • Processing Transparent Substrates in the VersaLine Systems
      • 6" Conversion Protocol
      • Images
      • Endpoint
    • SPTS uetch vapor etch system, uetch
      • SPTS uetch vapor etch system
    • Oxford-rie
      • oxford-rie, new wiki link
      • Operating Instructions- Ox-RIE
      • SiO2 Etch Characterization
  • Annealing, Oxidation & Doping
    • Furnaces, oxidation and annealing (clean, semi-clean and contaminated)
      • Thermco Oxidation and Annealing Furnaces, Thermco1 - 4
      • Furnaces, Forming Gas Anneal (FGA), tylanfga and fga2
      • Oxide Thickness Calculators
    • Rapid Thermal Annealing
      • All-Win 610 Rapid Thermal Process Systems
    • Doping
      • POCl3 and BBr3 Predep Furnaces- tylan5 and tylan6
  • Wet Benches Summary
    • Wet Bench Clean
      • Wet Bench Clean-1 and -2
    • Wet Bench Clean_res-piranha and -hf (former Nonmetal)
      • Wet Bench Clean_res-piranha and -hf
    • Wet Bench Decon and Clean-3
      • wbdecon and wbclean-3
    • Wet Bench Metal
      • Wet Bench Metal, wbmetal
    • Wet Bench Nitride
      • Wet Bench Nitride, wbnitride
    • Wet Bench Flexcorr-3 and -4
      • Wet Bench Flexcorr-3 and -4, wbflexcorr-3 and -4
    • Wet Bench wbflexcorr-1 and wbflexcorr-2
      • Wet Bench wbflexcorr-1 and -2
    • Wet Bench Germanium
      • Wet Bench Germanium, wbgen2
    • Wet Bench Solvent
      • Wet Bench Solvent, wbflexsolv-1 and -2
      • Lithography Solvent Bench, lithosolv
    • Miscellaneous Photoresist Wet Bench
      • Miscellaneous Photoresist Wet Bench, wbmiscres
    • CPD
      • CPD Critical Point Dryer Tousimis 915B, cpd
    • Additional Process Info
    • Wet Bench Operating Instructions, WAFAB
  • Wafer Bonding, Sawing & Polishing
    • GnP POLI-400L: cmp
      • CMP
    • EV Group Wafer Bonder: evbond
      • Electronic Vision 501 Bonder, evbond
    • Benchtop Muffle Furnace: thermolyne
    • K&S 775 Wafer Dicing Saw: wafersaw
      • K&S Dicing Blades
      • wafersaw Operation
    • DISCO Wafer Saw
      • DISCO Wafersaw Operating Procedure
      • Images
    • Lasercutter
      • Lasercutter
    • Micromill
  • Characterization & Testing Summary
    • Cornell's Test Equipment Tutorial
    • AFM2
      • AFM2, afm2
    • Alphastep 500
      • Alphastep 500
    • Flexus 2320
      • Flexus 2320 Stress Gage, stresstest
    • Nanospec
      • Nanospec 010-180, nanospec
      • Nanospec 210XP, nanospec2
    • Prometrix
      • Prometrix OmniMap RS35c, prometrix
    • Tencor P2
      • Tencor P2, p2
    • Woollam M2000
      • Woollam M2000 Company Website
      • SNF Woollam M2000 Spectroscopic Ellipsometer Instructions
      • SNF Woollam Wafer Mapping Instructions (VASE MANAGER)
    • Microscope
    • Sensofar S-neox
      • Sensofar S-neox
    • Micromanipulator6000
      • micromanipulator6000
  • Lab Maps
    • Equipment Locations (PDF)
    • Emergency Map (gif)
    • Emergency Map (PDF)
  • ExFab (previously known as nSiL)
    • PDS 2010 LABCOTER™ 2 Parylene Deposition System
      • Parylene Coater Run Sheet
      • PDS2010 Labcoter 2 Parylene Deposition System
      • Parylene Properties Reference
      • PDS 2010 LABCOATER 2 Parylene Deposition System
      • Parylene Coater Run Sheet
    • Glovebox
      • nSiL Glovebox- Training and Operating Manual
    • Solidscape 3d Wax Printer
      • Solidscape 3d Wax Printer
    • Heidelberg MLA 150
      • User Manual
      • Quick guide - Heidelberg MLA 150
      • Design Guide
      • Design Conversion Guide
      • Quick User Guide - Heidelberg MLA 150
      • User Manual
      • Design Conversion Guide
      • Design Guide
    • Finetech Lambda Flipchip bonder
      • Finetech Fineplacer Lambda Operating Instructions
      • Lab Member Project Reports
    • Lesker - Sputter
      • Lesker - Sputter
    • AJA Evaporator
      • AJA Evaporator
    • Raith Ebeam Lithography tool
      • Link to Raith Ebeam Lithography tool
    • DISCO Wafer Saw
      • Link to DISCO wafer saw
    • Wbexfab_solv, Wbexfab_solv-plug
      • Wbexfab_solv, Wbexfab_solv-plug
      • Wbflex_solv images
      • Wbexfab_solv hot plate controller programming
      • Wbexfab_solv and wbexfab_solv-plug
    • Headway 3
      • Headway 3
      • Headway 3 images
      • Headway 3 Manual
    • YES Oven 2
    • Malvern Zetasizer DLS
    • Thinky Mixer
    • Cytoviva
    • Jasco UV-Vis-NIR
    • Ultron Tape Mounter
      • Ultron Tape Mounter
    • Optomec
      • Optomec Manual
      • Optomec Manual
    • Nanoscribe Photonics Professional GT
      • Nanoscribe Photonics Professional GT Manual
      • Nanoscribe Photonics Professional GT Manual
    • Micromist Coater
      • Micromist coater user manual
      • Micromist coater user manual
    • Alveole Primo
      • Alveole Primo Protein Patterning Protocol
      • Alveole Primo Protein Patterning Protocol
    • Asylum AFM with environmental control chamber
    • Sinton Lifetime Tester
    • DISCO Backgrinder
  • Monthly Tool Monitoring
• Process
  • SNF Process, links
  • Process Modules
    • Process Modules
    • Photolithography
      • Standard Resists at SNF
      • EBeam Resists at SNF
      • Lift Off Procedures
      • SU-8 Procedures
      • Polyimide Procedures
      • Photoresist Exposure KS and EVG aligners Time Table
      • Resist Modules
      • Photolithography Qualifications
      • Common photolithography problems at SNF
      • Maskmaking
    • Etching
      • Wet Etching
      • Dry Etching
    • Oxidation Furnaces- grown oxides
      • Oxide Thickness Calculators
    • Cleaning and Stripping of Substrates, Labware and Tweezers
      • Diffusion Cleaning at SNF
      • Photoresist Stripping
      • Tweezers Cleaning
    • EE410 Device
    • Ebeam Resists
      • Ma-N 2403
      • E-Spacer 300Z
      • 2% 950K PMMA
  • Runsheets
    • Runsheets, google docs link
    • Basic Processing at SNF Runsheet
    • Runsheets for Etch Qualification Test Wafers
      • Guide to Wafer Production for Etch Tool and Process Qualification Wafers
      • Runsheet for 100nm Thermal Oxidation Test Wafers
      • Runsheet for 1um LTO Test Wafers
    • EE410 Runsheet 2007-8
    • EE410 CMOS Runsheet Winter 2015
    • EE410 LOCOS Run Sheet -March 2017
    • EE312 - Runsheet
  • Process Resources
    • TOx Thickness Calculator
    • Tylan Monitoring
    • Gage Readings
  • Other Resources
    • Shadow Masks
  • Community Service Projects
    • About Community Service
    • Polysilicon characterization
      • Low Stress PolySi -Exptl Plan
      • Low Stress PolySi Characterization Report
    • EE410 Redesign
      • EE410 Redesign Summary
    • Cleanliness & Contamination
      • TXRF analysis of gold-contaminated wafers
    • PEB Characterization
    • drytek4 Characterization
    • STSetch2 Characterizations
      • SOI etch-Khuri-Yakub Group
      • High Aspect Ratio/Narrow Trenches
    • ALD HfO2 characterization for RRAM
      • ALD Oxide Characterization Proposal
    • MVD- Polyimide Development
      • MVD Polyimide Community Service Proposal
      • EE412 Fall 2014 Report
      • MVD Polyimide EE412 proposal
    • Carbon Nanotube Furnace- Recipe development and characterization
      • CNT Furnace Recipe Development Proposal
    • MOCVD process development and sample characterization
      • PL mapping of III-nitrides
      • AlGaN/GaN HEMT structure on Si.pdf
  • Fab Project Courses: E241 & EE412
    • EE412 and E241 Projects: List and links to reports and presentations
  • PDMS processing at SNF
    • PDMS Processing at the SNF
  • MOCVD Workshop
    • MOCVD_Workshop_Presentation_Prof. Debbie Senesky
    • MOCVD Workshop Presentation-Nanometrics
    • MOCVD Workshop Presentation-Lehighton
    • MOCVD Workshop Presentation-Dr. Xiaoqing Xu
  • EE410 and EE312
    • EE410 and EE312 Comprehensive summary
    • SNF410 NMOS process flow without isolation
    • SNF410 Depletion NMOS Report
• Materials/Chemicals
  • Contamination Groups at SNF
    • Contamination Groups for Controlling Process Flow Materials
  • MSDS-Standard Chemicals
    • SDS, link to snf-web
    • SDS gases, files only
      • 15% Arsine 85% Nitrogen
      • Argon
      • Boron Trichloride
      • Boron Trifluoride
      • Carbon Dioxide (Matheson)
      • Carbon Dioxide (Praxair)
      • Chlorine
      • Chlorine
      • Disilane
      • Dichlorosilane
      • Halocarbon 14
      • Halocarbon 23
      • Halocarbon 22
      • Halocarbon 116
      • Helium
      • Hydrogen Bromide
      • Methane
      • Nitrogen Trifluoride
      • Nitrogen
      • Nitrous Oxide (Air Products)
      • Nitrous Oxide (Praxair)
      • Boron Tribromide (BBr3)
      • Silane (Air Products)
      • Silane (Praxair)
      • Silicon Tetrachloride
      • Sulfur Hexafluoride (Praxair)
      • Phosphorous Oxychloride (POCl)
      • Sulfur Hexafluoride (Air Products)
      • Ammonia
      • Ultrasol 2EX MSDS
      • Ultrasol S10 MSDS
      • A-174 Silane
      • MICRO-90 CONCENTRATED CLEANING SOLUTION
      • Parylene Dimer DPX-C
    • SDS (MSDS) and information: Gases
      • Nitrogen Trifluoride (NF3)
      • Chlorine(Cl2)
      • Hydrogen Bromide (HBr)
      • 100ppm Arsine in Hydrogen (100 ppm AsH3/H2)
      • Germane(GeH4)
      • 1% Phosphine/Hydrogen (1%PH3/H2)
      • Hydrogen Chloride (HCl)
      • 15% Phosphine in Silane (15% PH3/SiH4)
      • 100ppm diborane in hydrogen (100ppm B2H6/H2)
      • 1% diborane in hydrogen (1% B2H6/H2)
      • Nitrous Oxide (N2O)
      • Ammonia (NH3)
      • Dichlorosilane(SiH2Cl2)
      • 5% Diborane in Hydrogen (5% B2H6/H2)
      • 10% Phosphine in hydrogen (10% PH3/H2)
      • 80% Methane in Argon (80% CH4/Ar)
      • 2% Boron Trichloride in Argon (2% BCl3/Ar)
      • 2% Silane in Nitrogen (2%SiH4/H2)
      • Silane (SiH4)
      • Methane (CH4)
      • Disilane (Si2H6)
      • 4% Hydrogen in Nitrogen (4% H2/N2)
      • Nitrogen (N2)
      • 15% Arsine in Nitrogen (15% AsH3/N2)
      • Argon
      • Boron Trichloride (BCl3)
      • Boron Trifluoride (BF3)
      • Carbon Dioxide (CO2)
      • Chlorine (Cl2)
      • Halocarbon 14
      • Halocarbon 23
      • Halocarbon 22
      • Halocarbon 116
      • Helium (He)
      • Silicon Tetrachloride (SiCl4)
      • Sulfur Hexafluoride (SF6)
    • MSDS ALD Precursors
      • TrimethylAluminum
      • Tetrakis(dimethylamido)titanium(IV) (TDMA-Ti) MSDS
      • Bis(ter-butylimino)bis(dimethylamino)tungsten(VI) MSDS
      • Tetrakis(dimethylamido)hafnium(IV) MSDS
      • Tungsten Hexacarbonyl W(CO)6
      • Tetrakis(dimethylamido)zirconium(IV) (TDMA-Zr) MSDS
      • Tetrakis(ethylmethylamido)zirconium(IV) (TEMA-Zr) MSDS
      • Tris(diethylamido)(tert-butylimido)tantalum(V)
      • Tris[dimethylamino]Silane (3DMAS) MSDS
      • (3-Aminopropyl)triethoxysilane (APTES) MSDS
      • Tris(tert-botoxy)silanol MSDS
      • Trimethyl(methylcyclopentadienyl)platinum(IV) MSDS
      • Bis(cyclopentadienyl)nickel (nickelocene) MSDS
      • Bis(ethylcyclopentadienyl)ruthenium(II) MSDS
      • Diethylzinc (DEZ) MSDS
      • Tris[N,N-bis(trimethylsilyl)amide]yttrium MSDS
      • Cyclopentadienyl-indium MSDS
      • Tetrakis(dimethylamino)tin(IV) TDMA-Sn MSDS
      • Tris(cyclopentadienyl)yttrium (3CpY) MSDS
      • Tetramethyl-Tin
      • Trimethylgallium
      • Bis(1,2,4-triteriarybutylcyclopentadienyl)-strontium
      • Bis(ethylcyclopentadienyl)nickel(II) MSDS
      • Ferrocene
      • Titanium (IV) Isopropoxide (TTIP) MSDS
      • Bis(n-propyltetramethycyclopentadienyl)barium MSDS
      • Bis(pentamethylcyclopentadienyl)barium, 1,2-dimethoxyethane adduct MSDS
      • Bis(cyclopentadienyl)cobalt (II) MSDS
      • Fe amidinate MSDS (Accudep Iron)
      • Pentakis(dimethylamino)tantalum(V)
      • MSDS Nickel bis(N,N'- ditertialbutylacetamidinate) AKA Dow Accudep-Ni
      • MSDS- Molybdenum hexacarbonyl
  • Process or Materials Review Requests (PROM) and Form
    • PROM Archive
    • PROM form Template
• Safety/Policies
  • Stanford EH&S
  • Stanford EH&S Chemical Safety Database
  • Stanford University - Utilities Services
    • Stanford University - Utilities Services
• Training
  • Training Calendar
  • About Equipment Training
  • Training Videos
  • Nano at Stanford Training and Educational Materials
    • nano@stanford Training and Educational Materials
    • Nano jpgs
      • “Nano @ Stanford - SNF” online training and education course
  • SNF Shadowing Form
• Links
  • Stanford Nano Shared Facilities (SNSF)
  • XReporter

Personal tools

• Log in