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2014 PROM Requests

PROM Request forms and supporting materials and from 2014
20140204 H. Kim- Kateeva (EPR-174)
Request for use of MicroChem Epoxy Permanent Resist version 174. Status: Approved as documented. Any changes to use need review by committee.
20140221 T. English- Crystal Bond 509 in Xactix (XeFe2) Etcher
Request to use Crystal Bond 509 in Xactix (XeFe2) Etcher. Crystal Bond 509 is approved for lab use but not standard for Xactix. Status: Approved for use with gold contamined chuck.
20140221 K. Harris- Clean Processing of Aluminum post CMP
Clean contamination category processing of Aluminum post CMP. Requires Al compatible clean (standard decon procedure includes SC2 which etches Al). Status: Approved to use the standard metal clean for post CMP clean and CCP or HD CVD oxide tools in clean contamination state.
20140226 X. Bai- Encapsulated 1cm2 GaAs substrate annealing in RTA
Encapsulated 1cm2 GaAs substrate annealing in RTA. GaAs substrates are not allowed in RTA without approval. Status: Approved as documented. Any changes will require review by committee.
20140307 L. Zhu Poly-Si deposition on Mo/Si substrate in ThermcoPoly2 (LPCVD)
Deposition of poly-Si on Mo/Si substrate in ThermocoPoly2 requires approval to demonstrate low vapor pressure of Mo at process conditions. Status: Approved.
20140131 D. Lu- SrTiO3 processing in CPD
Inquiry into acceptability of SrTiO3 for processing in CPD (Gold level contmainated equipment). Status: Approved.
2014031714 W. Liu- Etching Polyacrylonitrile- lithium perchlorate membrane with Au mask
Request to use PAN-LiClO4 film in PT-OX. Concern is using Li compounds in the shared equipment. Status: Approved for documented runs. Additional runs or larger substrates will require review by PROM committee.
20140207 K. Todd- Mercury Cadmium Telluride on a Zinc Cadmium Telluride substrate in lithography
Request to use HgCdTe or ZnCdTe for e-beam lthography.
20140228 M. Hou- Li2CO3 ALD
Request to perform ALD of Li2O3 in Savannah. Requires new precursors and significant handling procedural changes to address safety issues. Status: Process approved as documented. Follow up documentation of equipment is required.
20140219 I. Narkeviciute- Ta sputter target for Metallica
Request to add a Ta sputter target to Metallica.
20140211 A. Benefante- Spin coat graphene onto substrates
Request to use Headway to spin coat graphene onto substrates inside of cleanroom. Status: Request approved for Laurell spinner in wafer saw room, denied for use in SNF.
20140205 P. Wei- Request for use of new Poly Imide (PI-2611 and VM-651) in SNF
Request to bring new chemicals into the lab for poly imide processing.
20140121 A. Ceballos- Process flow from PT-DSE (contaminated) to epi2 (clean)
Request to process wafers in violation of lab contamination requirements.
20140123 J. Kruger- SOD P507 for Ge(Sn) epi on Si
Request to bring in Filmtronics P507 Spin on Dopant
20140410 T. Lin- Request for Zinc Phosphorus Dopant Coating
PROM request for Zinc Phosphorous Spin on Dopant coating and anneal. Status: Rejected.
20140529 T. Lu- Request for Use of Glass Wafer Cleaning Detergent
Request to use Alconox Detergent 8 and Deconex 12 NS-x from Borer Chemie AG
20140602 F. Toufexis- Lanthanum Hexaboride (LaB6) and Cerium Hexaboride (CeB6) Sputtering in Metalica
PROM request and supporting materials
20140725 A. Gupta- Etching T12B SOG in PT-OX
PROM request and supporting documents for T12B etching in PT-Ox
20140725 A. Gupta- Etching T12 SOG in PT-MTL
Request and supporting material to etch T12 SOG material in PT-MTL etcher
20140725 A. Gupta- Etching FOx-22 SOG in PT-Ox
Request and supporting materials to etch FOx-22 Spin on Glass in PT-Ox
20140725 A. Gupta- Etching FOx spin on glass in PT-MTL
PROM form and supporting materials for etching FOx spin on glass in PT-MTL. Approved although PT-Ox recommended due to CHF3 availability.
20140725 A. Gupta- Etching Cytop in PT-Ox etcher
PROM form and supporting documents for etching Cytop spin on glass in PT-Ox etcher
20140725 A. Gupta- Etching Ctyop in PT-MTL etcher
PROM request and supporting materials to etch Cytop in PT-MTL etcher. Approved. PT-Ox recommended due to CHF3 availability but material is approved for PT-MTL.
20140515 K. Dowling- Use of Copper Mask in SF6/O2 chemistry in PT MTL
PROM form and supporting documents for Use of Copper Mask in SF6/O2 chemistry in PT MTL.
20140624 W. Kao- GaAs processing and citric acid introduction
PROM form to bring GaAs wafers into SNF to process in gold level contamination tools as well as to bring in citric acid. Request approved.
20140715 K. Harrison- Use of Crystal Bond 509 in Lampoly etcher
PROM request form to use Crystal Bond 509 in Lampoly. Conditional approval. Crystal Bond use requires additional characterization and procedure definition. Alternatives proposed.
20140715 K. Harrison- Use of Crystal Bond 555 in Lampoly
PROM form for use of Crystal Bond 555 in Lampoly etcher. Crystal Bond use requires additional characterization and procedure definition. Alternatives proposed.
20140507 M. Shulaker- Resist in HF vapor etcher
Request to use photoresist in the HF Vapor Etcher (currently not allowed). Approved by PROM committee, Gary Yama to have final call.
20140506 J. Sohn- CLK-820
Request and supporting materials to use CLK-820 in the lab on an ongoing basis. Approved.
20140813 J. Briggs- Ionic Liquid for Electrolyte Transistor
Request to measure non-toxic liquid electrolyte on Woollam. Request approved.
20140812 J. Katz- PGMEA use in SNF.
Request to use PGMEA in SNF tools. Request approved.
20140812 J. Katz- PS-PMMA use in SNF
Request to use PS-PMMA in SNF. Request approved.
20140918 J. Katz- PS-OH use in SNF
Request to use PS-OH polymer in SNF. Request approved.
20140922 J. Provine Dichlorosilane processing on Fiji1
Request to use DCS as a precursor on Fiji1. Approved with modifications/clarifications.
20141007 K. Smithe- Y processing at wbflexcorr
Request to etch Y at wbflexcorr. Approved for documented quantities.
20140829 J. Kruger- UV Cured Adhesive use
Request to use NOA89 or NOA75. Request approved.
20141007 J. Park- InAs on GaAs in Fiji2 and Savannah
Request to process InAs deposited on GaAs in gold-contamination ALD tools (Savannah and Fiji2). Approved for documented quantities and processes.
20140825 A. Gupta- CCP PECVD on T12B SOG
Request to deposit dielectric material using CCP PECVD on T12B SOG. Request withdrawn.
20141010 A. Gupta- CCP PECVD on FOx-22
Request to deposit dielectric material using CCP PECVD on FOx-22 SOG. Request approved.
20141010 A. Gupta- CCP PECVD on CYTOP 809M SOG
Request to deposit dielectric material using CCP PECVD on CYTOP 809M SOG
20141013 T. English- Polyimide MLD
Request to use MVD to develop polyimide film deposition.
20141015 L. Petti- PI2611 and PI2610 Use in SNF
Request to use PI2611 and PI2610 in the SNF. Request approved.
20141021 J. Kreikebaum- Nb etch in PT Metal
Request to use PT Metal to etch Nb. Request approved.
20141024 A. El-Ghazaly- Slightly Elevated Temperature Processing of HF
Request to use SNF to etch PZT materials using elevated temperature HF solution. Request rejected due to safety concerns.
20141028 T. Lu- Oxalic Acid
Request to use Oxalic Acid in the SNF. Request approved.
20141031 J. Park- ALD film thickness 150nm
Request to deposit 150nm of film in ALD (50nm is upper limit). Request approved.
20141101 Sedigh, M.- HMDS for Cypress HX3 Lead Frame
Request to do YES oven recipe skews. Request approved.
20141105 A. Gupta- Mesitylene use in SNF
Request to use Mesitylene in SNF. Request approved.
20141105 A. Rider- Metal CMP
Request to use CMP to polish metal. Status is open, waiting response from requestor.
20141105 A. Ceballos- PT-DSE to CLEAN process flow
Request to change contamination policy to allow processing in PT-DSE as a clean tool. Conditional approval. Follow up data required.
20141106 D. Nam- Request for 150nm ALD film
Request to deposit 150nm Al2O3 in ALD. Request rejected due to insufficient information regarding need for ALD.
20141106 L. Petti- Polymers 575771 and 593052 use in SNF
Request to use Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution (575771) and Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution (593052) in the SNF. Request approved.
20141111 S. Zappe- use of dry film photoresist (MX5015) with developer (0.75wt% potassium carbonate) and remover (EKC-162)
Request to use MX5015 and developer in the SNF. Approved as documented. Any changes will require re-review.
20141119 Y. Li- Constantan (0.55Cu-0.45Ni) sputtering target for Metalica
Request for a new target to be used in Metallica.
20141118 P. Ramesh- Contamination Study of Zinc Oxide Anneal
Request to collect data to determine impact of ZnO in anneal furnaces. Approved. Data will be updated once collected.
20141204 T. English- Diamine (DAH) Precursor for MLD of Polymers
Request for new precursor for MVD system.

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