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2014 PROM REQUESTS SUMMARY TABLE

Index of PROM requests for 2014
Date Title Requester Description Status
12/04/2014
Diamine (DAH) Precursor for MLD of Polymers
English, T.
Request for new precursor for MVD.
Approved.
11/19/2014
Constantan (0.55Cu-0.45Ni) sputtering target for Metalica
Li, Y.
Request for new Metallica target.
Approved.
11/18/2014
Contamination Study of ZnO Anneal
Ramesh, P.
Request to collect data to determine impact of ZnO anneal in furnaces.
Approved.  Data will be updated once results are back.
11/11/2014
use of dry film photoresist (MX5015) with developer (0.75wt% potassium carbonate) and remover (EKC-162)
Zappe, S.
Request to use alternate dry film photoresist and developer.  Potassium carbonate handling requires specific safety precautions.
Approved.  Any changes to location or quantities need review.
11/06/2014
Polymers 575771 and 593052 use in SNF
Petti, L.
Request to use Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution (575771) and Poly(pyromellitic dianhydride-co-4,4′-oxydianiline), amic acid solution (593052) in the SNF.
Approved.
11/06/2014
Request for 150nm ALD film
Nam, D.
Request to deposit 150nm Al2O3 in ALD.
Rejected due to insufficient information regarding requirement for ALD vs. other deposition methods.
11/06/2014
PT-DSE to CLEAN contamination process flow
Ceballos, A.
Request to process materials in CLEAN process equipment after PT-DSE.  This requires a change in contamination policy.
Conditional approval.  Data must be analyzed before final approval.
11/05/2014
Metal CMP
Rider, A.
Request to use CMP to polish gold.
Approved.
11/05/2014
Mesitylene in SNF
Gupta, A.
Request to use Mesitylene in SNF.
Approved.
11/01/2014
HMDS for Cypress HX3 Lead Frame
Sedigh, M.
Request for YES oven recipe skews.
Approved.
10/31/2014
ALD film thickness 150nm
Park, J.
Request to deposit 150nm of ALD film (upper limit is 50nm).
Approved.
10/28/2014
Oxalic acid in the SNF
Lu, T.
Request to use oxalic acid in the SNF.
Approved.
10/24/2014
Slightly Elevated Temperature Processing of HF
El-Ghazaly, A.
Request to use SNF to etch PZT materials using elevated temperature HF solution. Rejected due to safety concerns.
10/21/2014
Nb etch in PT-Metal
Kreikebaum, J.
Request to use PT Metal to etch Nb.
Approved.
10/15/2014
PI2611 and PI2610 use in SNF
Petti, L.
Request to use PI2611 and 2610 in SNF.
Approved.
10/13/2014
Polyimide MLD
English, T.
Request to use MVD to develop polyimide film deposition.
Approved.
10/10/2014
CCP PECVD on CYTOP 809M
Gupta, A.
Request to deposit dielectric material using CCP PECVD on CYTOP 809M SOG. Approved.
10/10/2014
CCP PECVD on FOx-22 SOG Gupta, A.
Request to deposit dielectric material using CCP PECVD on FOx-22 SOG. Approved.
10/07/2014
InAs on GaAs piece in Fiji2 and Savannah
Park, J.
Request to process InAs deposited on GaAs in gold-contamination ALD tools (Savannah and Fiji2).
Approved for documented quantities.  Pieces need to cool in load lock before retrieval on Fiji2.
10/07/2014
Etching Y on MoS2 substrate at wbflexcorr
Smithe, K.
Request to etch Y at wbflexcorr.
Approved for documented quantities.  Re-approval required if quantities change.
9/22/2014
Dichlorosilane processing on Fiji1
Provine, J.
Request to use DCS precursor on Fiji1. 
Approved with modifications.  Clarifications regarding DCS monitoring during processing added.
9/18/2014
PS-OH use in SNF
Katz, J.
Request to use PS-OH polymer in SNF.
Approved.
8/29/2014
UV Cured adhesive use
Kruger, J.
Request to use NOA89 or NOA75 in SNF.
Approved.
8/25/2014
CCP PECVD on T12B SOG
Gupta, A.
Request to deposit dielectric material using CCP PECVD on T12B SOG
Withdrawn.
8/13/2014
Ionic Liquid on Woollam
Briggs, J.
Request to use measure non-hazardous liquid electrolyte on Woollam.
Approved.  Required to use a cap covered cuvette to transfer liquid across the lab.
8/12/2014
PGMEA use in SNF
Katz, J.
Request to use PGMEA in SNF tools.
Approved.
8/12/1014
PS-PMMA use in SNF
Katz, J.
Request to use PS-PMMA in SNF tools.
Approved.
7/25/2014
Etching Cytop 809M in PT-MTL
Gupta, A.
Request to etch Cytop spin on glass in PT-MTL etcher.
Approved.  PT-Ox recommended due to CHF3 availability but material is approved for PT-MTL.
7/25/2014
Etching Cytop 809M in PT-Ox
Gupta, A.
Request to etch Cytop spin on glass in PT-Ox etcher.
Approved.
7/25/2014
Etching FOx-22 in PT-MTL
Gupta, A.
Request to etch FOx-22 spin on glass in PT-MTL etcher.
Approved.  PT-Ox recommended due to CHF3 availability but material is approved for PT-MTL.
7/25/2014
Etching FOx-22 in PT-Ox
Gupta, A.
Request to etch FOx-22 spin on glass in PT-OX etcher.
Approved.
7/25/2014
Etching T12B SOG in PT-MTL
Gupta, A.
Request to etch T12B spin on glass in PT-MTL etcher.
Approved.  PT-Ox recommended due to CHF3 availability but material is approved for PT-MTL.
7/25/2014
Etching T12B SOG in Pt-Ox
Gupta, A.
Request to etch T12B spin on glass in PT-OX etcher.
Approved.
7/15/2014
Use of Crystalbond 555 in Lampoly
Harrison, K.
Request to use Crystal Bond 555 to mount chips on wafer in Lampoly etcher. Conditional approval.  Crystal Bond use requires additional characterization and procedure definition.  Alternatives proposed.
7/15/2014
Use of Crystal Bond 509-HMP in Lampoly
Harrison, K.
Request to use Crystal Bond 509 to mount chips on wafer in Lampoly etcher.
Conditional approval.  Crystal Bond use requires additional characterization and procedure definition.  Alternatives proposed.
6/25/2014
GaAs processing and citric acid introduction
Kao, W.
Request to use GaAs substrates in gold contamination level tools and to bring in citric acid.
Approved.
6/10/2014
Use of Copper Mask in SF6/O2 chemistry in PT-MTL
Dowling, K.
Request to use copper as a masking layer for etch in PT-MTL using SF6/O2 chemistry.
Rejected.  Risks to both equipment and subsequent users deemed too high.  Efforts to find alternative path ongoing.
6/02/2014
Lanthanum Hexaboride (LaB6) and Cerium Hexaboride (CeB6) Sputtering in Metalica
Toufexis, F.
Request for new sputtering targets (LaB6 and CeB6) for use in Metalica
Approved.
5/29/2014
Request for use of glass wafer cleaning detergent
Lu, T.
Request to use Alconex Detergent 8 and Borer Chemie AG Deconex NS-x to clean glass wafers for particle removal.
Approved.  1 gallon chemical needs to be poured into smaller amber bottle for storage in the lab.
5/16/2014
CLK-820
Sohn, J.
Request to use J.T. Baker CLK-820 photoresist stripper for Cu on an ongoing basis.
Approved.
5/7/2014
Resist in HF vapor etcher
Shulaker, M.
Request to use resist covered wafer in HF vapor etcher (currently not allowed). 
Approved.  Final call on processing to be determined by Gary Yama.
4/10/2014
Request for Zinc Phosphorus Dopant Coating
Lin, T.
Request to dispense and anneal Zinc Phosphorus spin on dopant in SNF.
Rejected.
3/17/2014
Etching Polyacrylonitrile-Lithium Perchlorate membrane with Au mask
Liu, W.
Request to use PAN-LiClO4 film in PT-OX. Concern is using Li compounds in the shared equipment. Approved for documented runs.  Additional runs or larger substrates will require review by PROM committee.
3/07/2014
Poly-Si Deposition on Mo/Si substrate in ThermcoPoly2 (LPCVD)
Zhu, L.
Deposition of poly-Si on Mo/Si substrate in ThermocoPoly2 requires approval to demonstrate low vapor pressure of Mo at process conditions. Approved.  Any changes to documented request will require re-evaluation by committee.
2/28/2014
Li2CO3 ALD
Hou, M.
Request to perform ALD of Li2CO3 in Savannah.  Request requires new precursors, equipment modification, and significant handling procedural changes to address safety issues.
Conditional Approval.  Process is approved as documented.  Equipment modifications will need to be documented and reviewed by PROM Committee.
2/26/2014
Encapsulated 1cm2 GaAs Substrate Annealing in RTA
Bai, X.
Encapsulated 1cm2 GaAs substrate annealing in RTA. GaAs substrates are not allowed in RTA without approval. Approved.  Any changes to documented request will require re-evaluation by committee.
2/21/2014
Clean Processing of Aluminum post CMP
Harris, K.
Clean contamination category processing of Aluminum post CMP. Requires Al compatible clean (standard decon procedure includes SC2 which etches Al). Approved to use the standard metal clean for post CMP clean and CCP or HD CVD oxide tools in clean contamination state.
2/21/2014
Crystal Bond 509 in Xactix (XeFe2) Etcher
English, T.
Request to use Crystal Bond 509 in Xactix (XeFe2) Etcher. Crystal Bond 509 is approved for lab use but not standard for Xactix. Approved for use with gold contaminated chuck.
2/19/2014
Tantalum Sputter Target for Metallica
Narkeviciute, I.
Request to introduce Ta target for Metallica. 
Approved.  Process parameters to be developed with J. Conway.
2/14/2014 Epoxy Permanent Resists from Microchem, version 174
Kim, H.
Request for use of MicroChem Epoxy Permanent Resist version 174. Approved.  Any changes to documented request will require re-evaluation by committee.
2/11/2014
Spin coat substrates with graphene
Benefante, A.
Request to use Headway spinner in SNF to spin coat graphene particles on substrates.
Approved for Laurell spinner OUTSIDE of SNF.  No loose nanoparticles to be spun inside of cleanroom.
2/07/2014 Mercury Cadmium Telluride on a Zinc Cadmium Telluride Substrate
Todd, K.
Request for HgCdTe on ZnCdTe substrate for use in e-beam lithography. Approved.
2/05/2014 Request for use of HD Microsystems PI-2611 and VM-651
Wei, P.
Request to bring new chemistries in for Poly Imide processing.
Approved.
2/04/2014
Request for use of EPR-174
Kim, H.
Request to bring MicroChem Epoxy Permanent Resist version 174 into SNF.
Approved.
1/31/2014 Use of Strontium Titanate Single Crystal substrate in CPD
Lu, D.
Inquiry to PROM committee.
Approved.
1/23/2014
Use of Filmtronics P507 SOD for Ge(Sn) epi on Si
Kruger, J.
Request to bring new SOD into SNF.
Approved.
1/21/2014
Process flow to go from PT-DSE (contaminated) to epi2 (clean)
Ceballos, A.
Process flow change request to go from contaminated to clean equipment (in violation of contmaination policy).
Rejected.  Further follow up from requester required.

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