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2017 PROM REQUESTS SUMMARY TABLE

Index of PROM requests for 2017

 

Date
Title Requester Description Status
1/24/2017 BaFe2As2 in Finetech bonder and s-neox
Taylor, S.
Request to use BaFe2As2 in Finetech bonder and s-neox.
Request approved.  Snorkel required during bonder use.
1/26/2017 New Chemicals for Lithography
Labmember
New chemicals proposed, run sheet and preliminary results documented.
Request approved.  Please see process staff for details.
2/9/2017 Ti3Se resist and AZ400K developer for selective HF etch
VanLaer, R.
Request to bring new chemicals in for lithography.
Request approved.
3/10/2017 Wet Etch Process using Nitric Acid and H2O2
Lu, C.
Use existing chemicals for Nitric and H2O2 at SNF for non standard process.
Request approved.
3/10/2017 Annealing of 1 cm2 GaAs Chip at 450 C in RTA
Peeters, L.
Procedure to anneal As containing chips at high temperatures while minimizing safety risk for inhaling As.
Request approved.
3/21/2017
Deposit LPCVD nitride on 10 nm ALD Al2O3 
Liu, F.
Procedure to go from Fiji1 (semiclean) to LPCVD furnace (clean).
Request approved.
4/13/2017 Etch of wafer pieces cut by DISCO Wafersaw in Lampoly
Wong, K.
Procedure to go from wafer saw to clean Lampoly etcher.
Request approved.
4/21/2017
Ammonium Sulfide (NH4)2S, 20% Aqueous solution
Paik, S.
Request and procedure to use (NH4)S into SNF
Request approved.
5/17/2017
Thick low-temp ALD Al2O3 for Insulating Spacers
Bozorg-Grayeli, T.
Request for long ALD run outside of standard operating procedure.
Request approved.
5/19/2017
Electrical Test Equipment for in-cleanroom capacitance test
Wu, Eric
Electrical Test Equipment for in-cleanroom capacitance test.  Location reviewed with staff.
Request approved.
5/20/2017
Ta3N5 ALD in Fiji3
Narkeviciute, I.
Request for non-standard processing in Fiji3.  Request approved.
Request approved.  Chamber isolation with HfO2 required after processing.
5/23/2017
Request to use Lampoly to etch Si deposited on ALD oxide/metal
Lee, K.
Etch non-standard semiclean films in clean Lampoly etcher.
Request approved.
5/24/2017
Hydrogen Anneal of Si Wafer after PT-DSE
Wong, Y.
Request to hydrogen anneal contaminated wafers in epi furnace.
Request approved to try H2 anneal in graphene furnace.  Data collection showed graphene furnace is not viable option.
6/13/2017
 A-061m Cu Etchant
Labmember
New chemistry for use in SNF.
Request approved.  Please see process staff for details.
6/13/2017 Strontium Aluminate Use
Labmember
Proposed process for use of strontium aluminate.
Request approved.  Please see process staff for details.
6/13/2017
Request to use Zeocoat CP1010-14
Labmember
Proposed process for use of Zeocoat CP1010-14.
Request approved.  Please see process staff for details. 
6/26/2017
HBr/Cl2 etching AlN in the Lampoly
Sarabalis, C.
Non-standard contamination level etching in Lampoly.
Request approved.
7/5/2017
Spin Coating and Evaporating Metal with Phenolic Resin
Chapin, C.
Bring new resin into SNF.  
Request approved for process in the new wetbench in ExFab. 
         
         
         
         
         
         
         
         
         

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