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Cleanliness & Contamination

This broadly-defined program encompasses any experimental work which may be required, proposed or performed to validate changes to the current cleanliness and contamination rules at SNF. For more information, contact any members of the C&C working group.
TXRF analysis of gold-contaminated wafers
A recent survey of the SNF community indicates that there is some interest in moving one of our DRIE tools, stsetch, into the Contaminated material group. Before doing so, we would like to quantify how much gold would be exposed to the plasma if a contaminated wafer were etched. This page describes the purpose, procedure and results of this experiment.

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