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E241 Projects

This project course focuses on developing processes for ExFab, a shared facility that supports flexible lithography, heterogeneous integration, and rapid micro prototyping. Team projects are approved by the instructor and are mentored by an ExFab staff member.
Areas of Interest
Project Name
Primary Tools Used
Researchers (and Mentors)
Date
Nanoparticle inkjet printing
Ink preparation and inkjet printing of
eutectic gallium indium nanodroplets
Fujifilm Dimatix Inkjet Printer
Eric Wu
(HyeRyoung Lee)
(Xiaoqing Xu)
Fall 2016
Flip Chip Bonding
Si and Glass Flip Chip Bonding with Solder Paste and Laser Cut Tape Stencils
Flipchip Bonder
Karen Dowling and Mimi Yang
(J Provine)
(Usha Raghuram)
(Astrid Tomada)
 Fall 2016
 Sputtering Optimizing the Electrical Stability of Platinum Films Deposited in Lesker - Sputter Lesker
Kirsten Kaplan
Karen Kim
Martin Winterkorn
(J Provine)
(Siva Baskharan)
Fall 2016
Sputtering on flexible materials
Controlled metal Deposition on Flexible Polyethylene Substrates by Sputtering for CO2 Reduction
Lesker
Jun Li
(Xioaqing Xu)
(HyeRyoung Lee)
Fall 2016
Microfluidics, 3D Printing
Development and characterization of wax molds for 3D microfluidic applications
3D Wax Printer
Rex Garland
Jonah Kohen
Fengjiao Lyu
(Michelle Rincon)
Fall 2016
 Flip Chip Bonding
Sapphire flip-­chip thermocompression and eutectic bonding for dielectric laser accelerator
Flipchip Bonder
Huiyang Deng
Yu Miao
(Usha Raghuram)
Fall 2016
Flip Chip Bonding
Development of thermocompression and eutectic bond processes for pre-patterned substrates using the Finetech Lambda
Flipchip Bonder
KiWook Jung
Heungdong Kwon
(Usha Raghuram)
Fall 2016

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