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EE412 Projects

EE412 is a project-based course focused on the development or characterization of processing methods used for the fabrication of devices in the Stanford Nanofabrication Facility (SNF). The SNF is a shared-use cleanroom providing micro- and nano- fabrication equipment and processing know-how for a diverse range of research areas. In this course, students can choose among several available projects or propose their own, with the objective of gaining experience in the practical aspects of process development and experimental design while contributing to SNF's library of processing methods.

 

 

Areas of Interest
Project Name
Primary Lab Tools Used Researchers and (Mentors)
Date
PECVD SiNx stress, Nanosphere etching
SiNx PECVD and Nanostructure Etching Recipe Development
CCP PECVD
STSDEP
PT-Ox
Yusi Chen and Muyu Xue
(Jim McVittie)
(Jim Harris)
6/2014
 Low Temp, Low Stress SiGe Process
 A Low Temperature, Low Stress SiGe Process
ThermcoPoly1
ThermcoPoly2
 Scott Lee and Chen Chen
(Maurice Stevens)
3/2011
Hydrophilic (ODS) and Hydrophobic (DETA) SAMS deposition on Pyrex and Si, uniformity and film quality
Molecular Vapor Deposition and Patterning of Organosilane Self-Assembled Monolayers for Directed Growth of Neuron Cells
MVD Felix Alfonso and Hsin-Ya Lou
(Michelle Rincon)
(J Provine)
6/2014
 ALD nitride films
 Development of Four Nitride Films; TiN, Hf3N4, WN, and AlN
 Savannah Shingo Yoneoka, Yi-Hsuan, Scott Lee and Chu-En Chang
(J Provine)
 12/2010
 ALD metal-nitride films
 Characterization of metal-nitride films deposited by the Savannah ALD system
 Savannah  Adair Gerke and Suhas Kumar
(J Provine)
(Krishna Saraswat)
 6/11
ALD HfO2 and Al2O3 films
 ALD Nanolaminates
 Savannah  Yi Wu, Shimeng Yu, and Shuang Li
(J Provine)
 12/2010
 Faster, better ALD TiN films
 TiN Characterization
 Fiji1
 Fiji2
 XPS
 Kye Okabe
Max Shulaker
(Michelle Rincon)
(J Provine)
 6/2014
Conformal AlO3, Hf2 and ZrO2
 ALD for Conformal and High Aspect Ratio Coverage
 Fiji1
Fiji2
Savannah
XeF2
 Wanki Kim and Insun Park
(J Provine)
 3/2011
 Conformality of ALD films; Al2O3, TiN and Pt
 Characterization of Fiji ALD Film Quality and Conformality in High Aspect Ratio/Deep Etched Structures
 Fiji1
Fiji2
Savannah
 Insun Park, Jooyong Sim and Young Ik Sohn
(J Provine)
 12/2011
 High-k dielectrics, Al2O3, HfO, MOSCAP
 ALD Dielectric Electrical Characterization
 Fiji1
Fiji2
Fiji3
Savannah
 Max Shulakar
(Michelle Rincon)
(J provine)
 6/2014
 Charge density study for HfO2 and Al2o3
 High-k/SiO2 interface Charge Characterization for ALD tools
 Savannah  Hong-Yu Chen and Luckshitha
(J Provine)
 3/2011
 Corrosive resistant ALD films; Al2O3, HfO2 and ZrO2
 Corrosive Resistant ALD Coatings
 Savannah  Joseph Doll and Alexandre Haemmerli
(J Provine)
 6/11
 Calibration of Tilt Angle Jig for Innotec
 Develop Calibration Process for Innotec Tilt Angle Jig
 Innotec  Shane Crippen
(J Provine)
 12/2011
Sidewall metal deposition on nanostructures
Procedure to Deposit Gold Only on the Sidewalls of Rectangular Nanostructures and Its Application
Innotec
MRC
Zain Zaidi
Saara Khan
(James Conway)
(J Provine)
(Michelle Rincon)
(Roger Howe)
6/2014
 SiC etching in PT-MTL
 Bulk Silicon Carbide etching in PT-MTL
 PT-MTL
Innotec
 Karen Dowling and Ashwin Shankar
(Jim McVittie)
(James Conway)
 6/2014
 Low temp deposition of Ti, SiO2 and W
 Sputtering Deposition of Metal and Dielectric Films
 Intelvac sputterer
 Vijay Parameshwaran
(Ed Myers)
 6/11
 InGaP and AlInP etching
 Developing Etching Process for Nanostructures on InGaP and AlInP Using OX-35 Etcher
 OX-35  Jieyang Jia and Li Zhao
(Mary Tang)
(Jim McVittie)
 6/2014
 HAR Etch for Sts2
 High Aspect Ratio Si Etching in STS2
 Stsetch2  Jae-Woong Jeong
(Jim McVitte)
 12/2010
 Sts2 Profile Characterization
 STSetch2 Profile Characterization- Undercut Investigation for Silicon Trench Etching in STSetch2
 Stsetch2  Lele Wang, Dong Liang and  Yu-Shuen Wang
(Jim McVittie)
 12/2010
Mixing Optical and E-beam Lithography
 Mix and Match: E-beam and Optical Lithography for Optical Gratings and Waveguide
 JEOL E-beam
ASML
 Chia-Ming Chang
(Richard Tiberio)
 6/11
 Spray coating of resist in 350um deep Si trench
 Deep Trench Spray Coating
 Evgspraycoat
Asml
Karthik Vijayraghavan
(Jason Parker)
 12/2010
 Spray coating of resist in 30-50um deep Si trenchs
 Characterization of EV Spraycoater; Conformal Coating in deep Trenches
 Evgspraycoat  Ehsan Sadeghipour
(Mahnaz Mansourpour)
(Jason Parker)
 3/2011
Graded Index lens using polymer layers of Norland Optical Adhesive with varying Refractive Indices  AGILE: Axially Graded Index Lens Fabrication
   Nina Vaidya
(Tom Carver)
 6/11
SiNx stress and conformity, added strain from backside and sidewall deposition
 PECVD SiNx Conformal Stressor Films
 STS Dep, p5000. drytek2
 Ching-Ying Lu, Matthew Morea
(Usha Raghuram)
(Jim McVittie)
(Prof Jim Harris)
12/2014
MEMS,  release strategies
 Surface Micromachining Method for Releasing a Range of Micron-Scale Membranes
 DRIE, fiji1, 2, 3, thermcopoly2, cmp, CCI-HD, xaticx
Martin Winterkorn, Anup Dadlani, Yongmin Kim
(J Provine)
(Michelle Rincon)
12/2014
 High aspect ratio etches with smooth sidewalls, 'Bosch' process recipes
 Smooth Sidewall Etching in PT-DSE
PT-DSE  Anfrew Ceballos, Stephen Hamann
(Usha Raghuram)
12/2014
 PMDA, ODA
 ALD Precursor Delivery & Debugging: A Case Study in Polymer Development
 MVD  Felix Alfonso, Tim English
(Michelle Rincon)
(J Provine)
12/2014
 Heterostructure based device isolation
 Development of Fluorine Plasma for AlGa/GaN Device Isolation
 PT-Ox, Ox-35, rta
 Caitlin Chapin, Minmin Hou
(Usha Raghuram)
(Prof Senesky)
12/2014
 ALD ZnO deposition
 Atomic Layer Deposition of Zinc Oxide
savannah


 Pranav Ramesh, Jiheng Zhao
(J Provine)
(Michelle Rincon)
12/2014
Graphene process development on copper substrates
Black Magic Pro 4" Graphene Furnace Development and Characterization
aixtron-graphene
Ning Wang, Christopher Neuman
(Michelle Rincon)
(Robert Chen)
(Ted Berg)
6/2015
DRIE, SOI, PT-DSE
Variable Trench Optimization for DRIE of SOI in PT-DSE PT-DSE
Ian Flader, Yunhan Chen
(Usha Raghuram)
6/2015
MOCVD, ASML, double exposure, JEOL, InSb, Ox III-V
Vertical Semiconductor Blades
JEOL, ASML, MOCVD, Ox III-V, ccp-dep, PT-OX, thermcoLTO, drytek2/4
Martin Winterkorn, Anup Dadlani, Karen Kim
(J Provine)
6/2015
Etch process to replace dicing and polishing for photonic waveguide testing
Deep Oxide Etch in PT-Ox to Replace Dicing and Polishing Process
PT-Ox, PT-DSE
Alex Piggott
(Usha Raghuram)
6/2015
Process development for polyimide MLD, Savannah thermal management understanding
Low Vapor Pressure Precursor Delivery: A Case Study in MLD of Polyimide
MVD
Tim English
(J Provine)
(Michelle Rincon)
6/2015
MEMS, MOCVD, GaN, AlN, AlGaN, development of wet etch chemistry for AlGaN
Development of Thin Film Release of GaN using AlN and AlGaN Buffer Layers for MEMS Applications
MOCVD
Caitlin Chapin, Karen Dowling
(Xiaoxing Xu)
6/2015
Ge/SiGe photo luminescence modification by ozone induced oxidation, annealing, and capping in ALD system
Ge/SiGe Surface Passivation by ALD
Fiji3
Ching-Ying Lu, Muyu Xue
(Michelle Rincon)
(J Provine)
6/2015
III-V, MOCVD InGaN, GaN and AlGaN on silicon doping
MOCVD Growth Calibration for GaN LED on Silicon
MOCVD
Yusi Chen, Jieyang Jia
(Xiaoxing Xu)
6/2015
Alternative to implantation for boron doping of silicon using Epi
Vapor Phase Doping of Boron in Silicon
Epi2
Kai Zang
(Maurice Stevens)
(Ted Kamins)
6/2015
Process development for aligned, horizontal nanotube growth on quartz in the new CNT furnace
FirstNano CNT Growth Furnace Recipe Development in SNF
cvd-nanotube
Greg Pitner, Ryan Swoboda
(Michelle Rincon)
(Robert Chen)
6/2015

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