Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Process / PDMS processing at SNF / PDMS reference papers / Elastomer-supported cold welding for room temperature wafer-level bonding

Elastomer-supported cold welding for room temperature wafer-level bonding

This paper presents a method for room-temperature wafer level bonding that is applicable for the MEMS and NEMS packaging and fabrication processes, but does not require an applied voltage, high pressure or vacuum. By applying a layer of elastomer between the wafer and gold overlayer, we successfully bonded two silicon wafers under limited load (~3KPa) at room temperature (25'C). One of the important potential applications of this technique is to create a temporary cap wafer that would protect already released, bulk or surface-micromachined structures during the dicing process. The initial results of experiments on the detachment of the temporary cap wafers bonded using this method are presented.

PDF document icon Zhang et al 2004.pdf — PDF document, 259 kB (266085 bytes)

Document Actions