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Diffusion Clean for LPCVD or Metal Deposition of Standard Metal Wafers (semi-clean)

This module covers the cleaning of wafers with standard metals for LPCVD (such as LTO) or metal deposition. This module assumes that the wafers do not have resist on them. For resist stripping please look at the section Photoresist Stripping.

Purpose:  to provide a clean for wafers with standard metals going into deposition tools using hot processing.

 

 

Equipment:  wbmetal

Time of execution: approximately 40 minutes

Step Summary:

time = 10:00 minutes

temperature = 40°C

chemical = PRS1000

dump rinse

spin dry

Detailed Procedure:  please see operating instructions for wbmetal

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