Resist Strip for Non-Standard Metal Materials, wet (contaminated)
Purpose: This module may also be used to strip polymer and resist off the surface of the wafer after plasma etching where the chemistry produces polymer.
Time of execution: approximately 40 minutes
Step 2 Summary:
time = 20:00 minutes
temperature = 40°C
chemical = PRX-127 (samples must be dry before going into this chemical)
air gun dry
NOTE: Use your own designated glass etch beaker to prevent contaminating your wafers. If your wafers are already contaminated you may use the beakers and holders at the wbgeneral (all of them are contaminated). Once you use a contaminated beaker -- your wafers must be considered contaminated and are restricted as to what equipment they may use.