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Resist Strip for Non-Standard Metal Materials, wet (contaminated)

The module covers the resist and/or polymer stripping of non-standard metals using wet chemistry.

Purpose:  This module may also be used to strip polymer and resist off the surface of the wafer after plasma etching where the chemistry produces polymer. 


Equipment; wbflexcorr-3and-4 or wbflexcorr-1and-2

Time of execution: approximately 40 minutes

Step 2 Summary:

time = 20:00 minutes

temperature = 60°C

chemical = SRS-100 (samples must be dry before going into this chemical) (note, SRS-100 etches copper)

overflow rinse

air gun dry


NOTE: Use your own designated glass etch beaker to prevent contaminating your wafers. If your wafers are already contaminated you may use the beakers and holders at the wbflexcorr (most of them are contaminated). Once you use a contaminated beaker -- your wafers must be considered contaminated and are restricted as to what equipment they may use. 

 Detailed Procedure:  Please refer to the operating instructions for wbflexcorr-3and-4 or wbflexcorr-1and-2.

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