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• Home
• Equipment
  • Equipment Summary
  • Beam Tools
    • Hummer V Sputter Coater: hummer
    • Raith 150 Ebeam Writer: RAITH
    • Hitachi S4160 SEM: sem4160
  • Optical Photolithography Overview
    • Resist Coat, Tool Summary
      • Headway
      • Laurell
      • SVG Coat Tracks 1&2
      • EV101 Spray coater
    • Exposure Tool Summary
      • ASML
      • KarlSuss Aligner
      • EV Group Contact Aligner
    • Develop Summary
      • SVG Developer
    • Oven Bake & Cure Summary
      • YES Oven
      • Blue M Oven
      • Oven 110C
      • Oven 90C
      • Singe Oven 150C
  • Chemical Vapor Deposition
    • Low Pressure CVD
      • Teos2
      • ThermcoNitride
      • ThermcoPoly
      • ThermcoPoly2
      • TylanNitride
      • TylanPoly
      • TylanSiGe
      • TylanBPSG
      • LPCVD tests
    • PECVD
      • PlasmaTherm Versaline HDPCVD
      • PlasmaTherm CCP-Dep
      • STS PECVD Tool
    • ALD
      • Savannah
      • Fiji1
      • Savannah Images
      • Fiji images
      • Fiji2
      • ALD Introductory Tutorial 2012-11-01
      • ALD In Depth Tutorial 2012-11-01
      • Films and Data
      • Data Files
      • Fiji3
    • Epi2 (Chamber A)
    • Epi papers/images
      • Sidewall epitaxial piezoresistor process and characterisation for in-plane force sensing applications
      • Room temperature 1.6 μm electroluminescence from Ge light emitting diode on Si substrate
      • Effects of hydrogen annealing on heteroepitaxial-Ge layers on Si: Surface roughness and electrical quality
      • Ge on Si by Novel Heteroepitaxy for High Efficiency Near Infrared Photodetection
      • Fabrication of High-Quality p-MOSFET in Ge Grown Heteroepitaxially on Si
      • High-efficiency metal–semiconductor–metal photodetectors on heteroepitaxially grown Ge on Si
      • Defect Reduction of Ge on Si by Selective Epitaxy and Hydrogen Annealing
      • Low-Temperature, LPCVD and Solid Phase Crystallization of Silicon–Germanium Films
      • Effect of Isochronal Hydrogen Annealing on Surface Roughness and Threading Dislocation Density of Epitaxial Ge on Si
      • Germanium In Situ Doped Epitaxial Growth on Si for High-Performance n+/p Junction Diode
      • Germanium In Situ Doped Epitaxial Growth on Si for High-Performance n+/p-Junction Diode
      • High-Efficiency p-i-n Photodetectors on Selective-Area-Grown Ge for Monolithic Integration
      • High Performance n-MOSFETs with Novel Source/Drain on Selectively Grown Ge on Si for Monolithic Integration
      • Effect of isochronal hydrogen annealing on surface roughness and threading dislocation density of epitaxial Ge films grown on Si
      • Low Temperature Germanium Growth on Silicon Oxide Using Boron Seed Layer and In Situ Dopant Activation
    • Epi2B (Chamber B)
  • Metalization & Sputtering
    • Evaporation
      • Innotec ES26C E-Beam Evaporator, innotec
      • IntlVac Nanochrome I Evaporator, intlvac_evap, Automatic
    • Sputtering
      • Metalica Sputter System
      • IntlVac Nanochrome I Sputter System, intlvac_sputter
      • Sputtering Papers
      • Intlvac_Sputter
  • Dry Etching
    • AMT 8100 Plasma Etcher, amtetcher (semi-clean)
      • AMT 8100 Plasma Etcher, amtetcher
      • Amtetcher Quick Start
      • Standard Recipes and Etch Rates
      • NEW! Recent qualification Results
      • Non-Standard and Lesser Used Recipes
      • 200 nm Structures using Amtetcher
      • Fine Example of RF arcing
    • Drytek2 Model 100, drytek2 (semiclean)
      • Drytek2 Model 100, drytek2
      • Drytek2 Quick Start Instructions
      • Standard Recipes and Etch Rates for Drytek2
      • NEW! Recent Process qualifications
      • Procedure for Balancing RF Power to Electrodes
    • Drytek4 Model 100 (modified), drytek4 (contaminated)
      • Drytek4 Model 100 (modified), drytek4
      • Etch Rates and Selectivities
    • Gasonics Aura Plasma Asher, gasonics (semi-clean)
      • Gasonics Plasma Asher
    • Lam Research 9400 TCP Poly Etcher, lampoly (clean)
      • Lam Research 9400 TCP Poly Etcher, lampoly
      • Clarycon Website
      • Etch Profiles
      • Isotropic silicon etching
      • Semiclean Wafers on lampoly/p5000etch Poly
      • Anistropic Etching of Single-Crystal Silicon
    • Matrix Plasma Asher, matrix (contaminated)
      • Matrix Plasma Asher, matrix
      • Matrix Quick Start Instructions
      • Cr in matrix
    • MRC Model 55 RIE, mrc (contaminated)
      • MRC Model 55 RIE, mrc
      • Quick Start for Martix
      • Selected Recipes
      • Qual results
      • Using the Pirani Gauge on the MRC
    • Applied Materials Precision 5000 Etcher, p5000etch (semi-clean)
      • Applied Materials Precision 5000 Etcher, p5000etch
      • Quick Start for P5000etch
      • NEW! Recent Process Qualifications
      • Endpoint Wavelengths
    • Plasma Quest ECR Etcher, pquest (contaminated)
      • Plasma Quest ECR Etcher, pquest
      • PQuest Chemistry Calendar
    • STS Deep RIE Etcher, stsetch (semi-clean)
      • STS Deep RIE Etcher, stsetch
      • Quick Start for Stsetch
      • SEM Images of Selected Process Qualification Wafers
      • Description of Wafer Holder
      • Characterization of a Time Multiplexed Inductively Coupled Plasma Etcher
      • Effect of wafer holder on etch profiles & grass
      • STS Deep RIE Etcher- Studies
    • STS HRM Deep RIE Etcher, stsetch2 (semi-clean)
      • STS HRM Deep RIE Etcher, stsetch2
      • STS II Response Table
      • Throttle vs Pressure- SF6
      • Throttle vs Pressure- C8F4
      • Crystalbond Procedure
      • STSetch2 etch profile
    • Xactix
      • Xactix: A XeF2 dry, chemical etcher
    • Oxford III-V Etcher
      • Operating Instructions- Ox-35
    • Plasmatherm Etchers (pt-dse, pt-ox and pt-mtl)
      • General Information about Plasma Therm Versaline Software
      • Typical Plasma Therm Versaline Process Sequence Steps
      • PlasmaTherm Deep Silicon Etcher (pt-dse)
      • PlasmaTherm Metal Etcher (pt-mtl)
      • PlasmaTherm Oxide Etcher (pt-ox)
      • Selected Suggested Recipes
      • Processing Transparent Substrates in the VersaLine Systems
    • General Information on Plasma Etching
      • Overview of Etchers Available at SNF
      • How to Attach Samples to Carrier Wafers for Plasma Etching or Deposition
  • Annealing, Oxidation & Doping
    • Furnaces, oxidation and annealing (clean, semi-clean and contaminated)
      • Tylan Oxidation and Annealing Furnaces, tylan1-4
      • Thermco Oxidation and Annealing Furnaces, Thermco1 & 2
      • Furnaces, Forming Gas Anneal (FGA), tylanfga and fga2
      • Oxide Thickness Calculators
    • Rapid Thermal Annealing
      • All-Win 610 Rapid Thermal Process Systems
    • Doping
      • POCl3 and BBr3 Predep Furnaces- tylan5 and tylan6
  • Wet Benches Summary
    • Wet Bench Clean
      • Wet Bench Clean-1 and 2 (former wbdiff)
      • Wet Bench Clean Checklist
      • new SC1
    • Wet Bench Nonmetal
      • Wet Bench Nonmetal, wbnonmetal
    • Wet Bench Decon and Clean-3
      • wbdecon and wbclean-3
    • Wet Bench Metal
      • Wet Bench Metal, wbmetal
    • Wet Bench Nitride
      • Wet Bench Nitride, wbnitride
    • Wet Bench Flexcorr-3 and -4
      • Wet Bench Flexcorr-3 and -4, wbflexcorr-3 and -4
      • Wet Bench General Checklist
    • Wet Bench wbflexcorr-1 and wbflexcorr-2
      • Wet Bench wbflexcorr-1 and -2
    • Wet Bench Germanium
      • Wet Bench Germanium, wbgen2
    • Wet Bench Solvent
      • Wet Bench Solvent, wbsolvent
      • Lithography Solvent Bench, lithosolv
    • Miscellaneous Photoresist Wet Bench
      • Miscellaneous Photoresist Wet Bench, wbmiscres
    • CPD
      • CPD Critical Point Dryer Tousimis 915B, cpd
      • Tousimis Company Website
    • HF Vapor Etch
      • HF Vapor Etch, wbnitride
    • Wet Bench Operating Instructions
    • Additional Process Info
    • Wet Bench Operating Instructions WAFAB
  • Wafer Bonding, Sawing & Polishing
    • GnP POLI-400L: cmp
      • CMP
    • EV Group Wafer Bonder: evbond
      • Electronic Vision 501 Bonder, evbond
    • Suss Wafer Bonder: ksbond
    • Benchtop Muffle Furnace: thermolyne
    • K&S 775 Wafer Dicing Saw: wafersaw
      • K&S Dicing Blades
      • wafersaw Operation
  • Characterization & Testing Summary
    • Cornell's Test Equipment Tutorial
    • AFM2
      • AFM2, afm2
      • 1-on-1 training
    • Alphastep 500
      • Alphastep 500
      • Alphastep 500 User Manual, Tencor Instruments
    • Flexus 2320
      • Flexus 2320 Stress Gage, stresstest
      • Tencor Flexus 2320 Manual
    • Nanospec
      • Nanospec 010-180, nanospec
      • Nanometrics Company Website
      • Nanospec 210XP, nanospec2
    • Prometrix
      • Prometrix OmniMap RS35c, prometrix
      • 49 point wafer mapping
      • Matlab File: 49 point wafer mapping
    • Rudolph
      • Rudolph Ellipsometer AutoEL III, ellipsomter
      • Rudolph Company Website
    • Tencor P2
      • Tencor P2, p2
    • Woollam M2000
      • Woollam M2000 Spectroscopic Ellipsometer, woollam
      • Woollam M2000 Company Website
      • Woollam Wafer Mapping Instructions (VASE Manager Program)
    • Zygo
      • Zygo White-Light 3D Surface Profiler, zygo
      • Zygo Company Website
    • Microscope
      • Optical Microscopy for Labmembers Working at SNF
  • Lab Maps
    • Equipment Locations (PDF)
    • Emergency Map (gif)
    • Emergency Map (PDF)
• Process
  • Process Modules
    • Photolithography
      • Standard Resists at SNF
      • Lift Off Procedures
      • SU-8 Procedures
      • Polyimide Procedures
      • Photoresist Exposure Time Table
      • Resist Modules
      • Photolithography Qualifications
      • Common photolithography problems at SNF
      • Maskmaking
    • Etching
      • Wet Etching
      • Dry Etching
      • Etch Rates for Various Etchants Wet and Dry
    • Oxidation Furnaces- grown oxides
      • Oxide Thickness Calculators
    • Chemical Vapor Deposition- deposited thin films
    • Cleaning and Stripping of Substrates, Labware and Tweezers
      • Diffusion Cleaning at SNF
      • Photoresist Stripping
      • Tweezers Cleaning
      • Cleaning of Labware
    • EE410 Device
    • Ebeam Resists
      • Ma-N 2403
      • E-Spacer 300Z
      • 2% 950K PMMA
  • Runsheets
    • Basic Processing at SNF Runsheet
    • Runsheets for Etch Qualification Test Wafers
      • Guide to Wafer Production for Etch Tool and Process Qualification Wafers
      • Runsheet for 100nm Thermal Oxidation Test Wafers
      • Runsheet for 1um LTO Test Wafers
    • EE410 Runsheet 2007-8
  • Process Resources
    • TOx Thickness Calculator
    • Tylan Monitoring
    • Gage Readings
    • Coral Desktops
    • USB on Sunrays
  • Other Resources
    • Shadow Masks
  • Community Service Projects
    • About Community Service
    • Nanoimprint
    • Polysilicon characterization
      • Low Stress PolySi -Exptl Plan
      • Low Stress PolySi Characterization Report
    • EE410 Redesign
      • EE410 Redesign Summary
    • Cleanliness & Contamination
      • TXRF analysis of gold-contaminated wafers
    • PEB Characterization
    • drytek4 Characterization
    • STSetch2 Characterizations
      • SOI etch-Khuri-Yakub Group
      • High Aspect Ratio/Narrow Trenches
  • EE412
    • About EE412: Advanced Nanofabrication Laboratory
    • Lecture Notes
      • Principles of Atomic Layer Deposition
    • Fall '10
      • Presentations
      • Final Reports
    • Winter '11
      • Presentations
      • Final Reports
    • Spring '11
      • Interim Reports
      • Final Report
    • Fall '11
      • Fiji-Proposal
      • Fiji-Week3
      • W-etching-Week3
      • AngledEvap-Week3
      • AngledEvap-Week4
      • W-Etching-Week4
      • Final report for the project on plasma ALD deposition in the Fiji
      • Final presentation for angled evaporation project
    • List of potential EE412 Projects
• Materials/Chemicals
  • Contamination Groups at SNF
    • Contamination Groups for Controlling Process Flow Materials
  • Applications Notes
    • SPR 955 CM i-line Resist
    • PRX-127
  • MSDS-Standard Chemicals
    • MSDS
      • Acetic Acid
      • Acetone
      • Ammonium hydroxide
      • 15% Arsine 85% Nitrogen
      • Argon
      • Boron Trichloride
      • Boron Trifluoride
      • Buffered Oxide Etch
      • Carbon Dioxide (Matheson)
      • Carbon Dioxide (Praxair)
      • Chlorine
      • Chlorine
      • Disilane
      • Dichlorosilane
      • EC Solvent 13
      • Ethylene Glycol
      • Halocarbon 14
      • Halocarbon 23
      • Halocarbon 22
      • Halocarbon 116
      • Hydrofluoric Acid
      • Hydrofluoric Dip
      • Helium
      • Hydrochloric Acid 37%
      • Hydrogen Peroxide 3%
      • Hydrogen Bromide
      • Aluminum (Al) Etchant, discontinued as of 2/14/14
      • HMDS
      • Isopropyl Alcohol
      • LDD 26W Developer
      • LOL 2000
      • 1-methyl-2-pyrrolidinone
      • Methane
      • MF-26A Developer
      • Methyl Alcohol
      • MF-322 Developer
      • MF-319 Developer
      • Chrome (Cr) Etchant, discontinued
      • Methyl Isobutyl Ketone
      • MF-CD-26 Developer
      • Nitrogen Trifluoride
      • Nitrogen
      • Gold (Au) Etchant
      • Nitric Acid 70%
      • Nitrous Oxide (Air Products)
      • Nitrous Oxide (Praxair)
      • Phosphoric Acid
      • Boron Tribromide (BBr3)
      • Potassium Hydroxide
      • PRX-127 Positive Photoresist stripper/remover
      • PRS 1000
      • Remover 1165
      • Silane (Air Products)
      • Silane (Praxair)
      • Silicon Tetrachloride
      • SU-8 Developer
      • SPR 220-7.0 Positive Photoresist
      • SPR 955CM-0.7 Positive Photoresist
      • SPR 220-3.0 Positive Photoresist
      • SPR 3617M Photoresist
      • Sulfur Hexafluoride (Praxair)
      • SPR 3612 Positive Photoresist
      • Phosphorous Oxychloride (POCl)
      • Sulfur Hexafluoride (Air Products)
      • Sulfuric Acid
      • Tetramethylammonium Hydroxide (TMAH)
      • UVN 30-0.8 DUV Photoresist
      • Xylenes
      • 950 PMMA Series
      • Praxair Online MSDS Library
      • Ammonia
      • Ultrasol 2EX MSDS
      • Ultrasol S10 MSDS
    • MSDS files
      • Ammonia (Air Products)
      • Ammonia (Praxair)
    • Liquid
      • Acetic acid (CH3COOH)
      • Acetone (CH3COCH3)
      • Ammonium Hydroxide (NH4OH)
      • Buffered Oxide Etch
      • EC Solvent 13
      • Ethylene Glycol ((CHOH)2)
      • Hydrofluoric acid (HF)
      • Hydrofluoric Dip (HF)
      • HDMS (Hexamethyldisilazane)
      • Isopropyl alcohol
      • LCD 26W Developer
      • 1-methyl-2-pyrrolidinone
      • MF-26A Developer
      • Methyl Alcohol (CH3OH)
      • MF-322 Developer
      • MF-319 Developer
      • Methyl Isobutyl Ketone (MIBK)
      • MF-CD-26 Developer
      • Phosphoric Acid (H3PO4)
      • Potassium Hydroxide (KOH)
      • PRX-127 Positive Photoresist stripper/remover
      • PRS-1000
      • Remover 1165
      • SU-8 Developer
      • SPR 220-7.0 Positive Photoresist
      • SPR 955CM-0.7 Positive Photoresist
      • SPR 220-3.0 Positive Photoresist
      • SPR 3617M Photoresist
      • SPR 3612 Positive Photoresist
      • Sulfuric Acid (H2SO4)
      • Tetramethylammonium Hydroxide (TMAH)
      • UVN 30-0.8 DUV Photoresist
      • Xylenes
      • 950 PMMA Series
      • Gold (Au) Etchant
      • Chrome (Cr) Etchant
      • Aluminum (Al) Etchant
    • Gas
      • Nitrogen Trifluoride (NF3)
      • Chlorine(Cl2)
      • Hydrogen Bromide (HBr)
      • 100ppm Arsine in Hydrogen (100 ppm AsH3/H2)
      • Germane(GeH4)
      • 1% Phosphine/Hydrogen (1%PH3/H2)
      • Hydrogen Chloride (HCl)
      • 15% Phosphine in Silane (15% PH3/SiH4)
      • 100ppm diborane in hydrogen (100ppm B2H6/H2)
      • 1% diborane in hydrogen (1% B2H6/H2)
      • Nitrous Oxide (N2O)
      • Ammonia (NH3)
      • Dichlorosilane(SiH2Cl2)
      • 5% Diborane in Hydrogen (5% B2H6/H2)
      • 10% Phosphine in hydrogen (10% PH3/H2)
      • 80% Methane in Argon (80% CH4/Ar)
      • 2% Boron Trichloride in Argon (2% BCl3/Ar)
      • 2% Silane in Nitrogen (2%SiH4/H2)
      • Silane (SiH4)
      • Methane (CH4)
      • Disilane (Si2H6)
      • 4% Hydrogen in Nitrogen (4% H2/N2)
      • Nitrogen (N2)
      • 15% Arsine in Nitrogen (15% AsH3/N2)
      • Argon
      • Boron Trichloride (BCl3)
      • Boron Trifluoride (BF3)
      • Carbon Dioxide (CO2)
      • Chlorine (Cl2)
      • Halocarbon 14
      • Halocarbon 23
      • Halocarbon 22
      • Halocarbon 116
      • Helium (He)
      • Silicon Tetrachloride (SiCl4)
      • Sulfur Hexafluoride (SF6)
    • MSDS ALD Precursors
      • TrimethylAluminum
      • Tetrakis(dimethylamido)titanium(IV) (TDMA-Ti) MSDS
      • Bis(ter-butylimino)bis(dimethylamino)tungsten(VI) MSDS
      • Tetrakis(dimethylamido)hafnium(IV) MSDS
      • Tungsten Hexacarbonyl W(CO)6
      • Tetrakis(dimethylamido)zirconium(IV) (TDMA-Zr) MSDS
      • Tetrakis(ethylmethylamido)zirconium(IV) (TEMA-Zr) MSDS
      • Tris(diethylamido)(tert-butylimido)tantalum(V)
      • Tris[dimethylamino]Silane (3DMAS) MSDS
      • (3-Aminopropyl)triethoxysilane (APTES) MSDS
      • Tris(tert-botoxy)silanol MSDS
      • Trimethyl(methylcyclopentadienyl)platinum(IV) MSDS
      • Bis(cyclopentadienyl)nickel (nickelocene) MSDS
      • Bis(ethylcyclopentadienyl)ruthenium(II) MSDS
      • Diethylzinc (DEZ) MSDS
      • Tris[N,N-bis(trimethylsilyl)amide]yttrium MSDS
      • Cyclopentadienyl-indium MSDS
      • Tetrakis(dimethylamino)tin(IV) TDMA-Sn MSDS
      • Tris(cyclopentadienyl)yttrium (3CpY) MSDS
      • Tetramethyl-Tin
      • Trimethylgallium
      • Bis(1,2,4-triteriarybutylcyclopentadienyl)-strontium
      • Bis(ethylcyclopentadienyl)nickel(II) MSDS
      • Ferrocene
      • Titanium (IV) Isopropoxide (TTIP) MSDS
      • Bis(n-propyltetramethycyclopentadienyl)barium MSDS
      • Bis(pentamethylcyclopentadienyl)barium, 1,2-dimethoxyethane adduct MSDS
      • Bis(cyclopentadienyl)cobalt (II) MSDS
      • Fe amidinate MSDS (Accudep Iron)
    • Stanford MSDS Page
  • Process or Materials Review Requests (PROM) and Form
    • Process or Materials Review (PROM) Form
    • 2014 PROM Requests
      • 20140204- Kateeva (EPR-174)
      • 20140221 Crystal Bond 509 in Xactix (XeFe2) Etcher
      • 20140221 K. Harris- Clean Processing of Aluminum post CMP
      • 20140226 X. Bai- Encapsulated 1cm2 GaAs substrate annealing in RTA
• Safety/Policies
  • Safety Orientation
    • Intro to SNF: Video
    • Safety at SNF: Video
    • Gowning: Video
  • Policies
    • Memo: Coral enable policies ....
  • Stanford EH&S
  • Stanford EH&S Chemical Safety Database
• Training
  • Training Calendar
  • About Equipment Training
  • Shadowing Form
  • Training Videos
    • KS Mask Aligner Training
• Links
  • Stanford Nanocharacterization Laboratory
  • XReporter
  • Stanford University
• Community
  • User Advisory Committee
  • Orientation by Users for Users
    • Orientation-Talk
      • Orientation By User for User v.130315
    • New User Orientation
• Staff Only
  • TGO Information
    • Sensor Changeouts
      • March2007
      • September2007
      • March2008
      • Honeywell Service Quote
      • January2009
    • Manuals
      • FMK Gas Sensors
      • Satellite Gas Sensors
      • FMK Sensor Head Module
      • Satellite Sensor Head Module - Analog
      • Satellite Sensor Head Module - Digital
    • SNF Documentation
      • TGO Matrix
      • HPM Systems Documentation
      • Industrial Hygiene Services
      • Procedures
      • Sensor Info

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