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ASML Target Marks using Amtetcher

Advantages in using the amtetcher to create the target marks is that a maximum of 24 wafers may be etched at one time. Additionally, the etch time is relatively short.


Purpose:

To etch 120nm zero or global alignment marks in Si in order that subsequent mask layers may be aligned.  Limited to four inch wafers.

 

Equipment:

Amtetcher

 

Time of Execution:

Approx. 30 minutes for 24 wafers.

 

Step Summary:

Amtetcher

Recipe: Program 4

Time: 5 minutes

 

Resist Strip: Photoresist Strip for Nonmetal Wafers- wet

 

 

Detailed Procedure:

Please see Amtetcher

 

 

 

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