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ASML Target Marks using Amtetcher

Advantages in using the amtetcher to create the target marks is that a maximum of 24 wafers may be etched at one time. Additionally, the etch time is relatively short.


To etch 120nm zero or global alignment marks in Si in order that subsequent mask layers may be aligned.  Limited to four inch wafers.





Time of Execution:

Approx. 30 minutes for 24 wafers.


Step Summary:


Recipe: Program 4

Time: 5 minutes


Resist Strip: Photoresist Strip for Nonmetal Wafers- wet



Detailed Procedure:

Please see Amtetcher




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