Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Process / Process Modules / Etching / Dry Etching / ASML Zero Level (Global) Target Marks / ASML Target Marks using P5000etch

ASML Target Marks using P5000etch

P5000etch may be used to etch the target marks. It processes one wafer at a time with a maximum of 8 wafers in the load lock per pumpdown. The etch itself is quite fast.

Purpose:

To etch 120nm zero or global alignment marks in Si in order that subsequent mask layers may be aligned.  Limited to four inch wafers.

 

 

Equipment:

P5000etch

 

 

 

Time of Execution:

Approx. 20 minutes per 8 wafers

 

 

 

Step Summary:

Chamber: CH. C (Si etch)

Recipe: CH C POLY ETCH

Time: 27seconds

 

Resist strip: Resist Strip for Nonmetal Wafers- wet

 

 

 

Detailed Procedure:

Please see p5000etch

for details

 

 

Document Actions