Silicon Etching in Drytek2 (semi-clean)
The purpose of this module is to give the user concise information on the etching of Si in drytek2.
Time of execution
approximately 30 mins to etch 100nm of Si for up to 6 wafers
SF6 = 117sccm
F22 = 51sccm
Etch rate = 160-200nm/min
Please see operating instructions for drytek2.
Note: for ASML Zero Level (Global) Target Marks use 30 secs.