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Silicon Etching in Stsetch (semi-clean)

A concise description of the standard Bosch process is given.

Purpose:

 Deep RIE of Silicon

Equipment:

 stsetch

Time of Execution:

 Overhead of about 5 mins per wafer plus etch time

 

Step Summary:

DEEP Recipe
SF6
C4F8
RF Coil
RF Platen
 Pressure  Etch Rate
Si
Etch 120sccm - 600W 12W 40mT 2.0um/min
Passivation -
85sccm 600W - 19mT -

 

Detailed Procedure:

 Please see equipment instructions for stsetch

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