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Silicon Etching in Stsetch2 (clean)

A concise description of the Bosch process is given.

Purpose:

 Deep RIE of Silicon

Equipment:

stsetch2

Time of Execution:

 Overhead of about 10 mins per two wafers

 

Step Summary:

 

Smooth Shallow Recipe
SF6
C4F8
RF Coil
RF Platen
 Pressure  Etch Rate
Si
Etch 400sccm 0
2500W 45W

Passivation 0
100sccm 1000W 0

0

 

 

Detailed Procedure:

Please see equipment information for stsetch2

 

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