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TMAH Si Etching at SNF

This process module describes TMAH Silicon etching at SNF.

Silicon Etching Using TMAH at SNF

Purpose:

 Etching Si.

Please note that by using clean quartzware the wafers may be brought back to a clean state.

Equipment:

 wbflexcorr-3 and -4

Time of Execution:

 Depends on the depth of the etch.  There is an approximate 30 minute set-up time.

 

Step Summary:

 20% TMAH at 95-100C etches about 1.2um/min.

 

Detailed Procedure:

 Please see TMAH Etching of Silicon for more details on the etching procedure.

Please see Wet Bench Flexcorr-3 and-4 for more information on the wet bench.

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