Skip to content. | Skip to navigation

Sections
Personal tools
You are here: Home / Process / Process Modules / Photolithography / Resist Modules / SINGE & PRIME Process module

SINGE & PRIME Process module

Purpose:

SINGE & PRIME wafer to improve adhesion between wafer and resist.

Equipment:

YES oven

Time of Execution:

 30 minutes

 

Step Summary:

Temperature 150°C

hexamethyldisilazane (HMDS)

 

Detailed Procedure:

 Photolithography

Document Actions