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Shipley 3612 Photoresist, 1um

Purpose:

 Standard resist Shipley3612 for 1 um on 4 inch wafers.

Equipment:

svgcoat/svgcoat2

Time of Execution:

 approximately 30 minutes

 

Step Summary:

Step 1:
HMDS prime done at Yes oven. To skip prime on tracks use prog 9, END 0.

Step 2:
Track 1, svgcoat:
Coat Program 7 - Shipley 3612 resist 1.0µm (dispenser 1) WITH 2mm or 5mm EDGE BEAD REMOVAL
Coat Program 2 - Shipley 3612 resist 1µm or 1.6µm (dispenser 1) WITHOUT EDGE BEAD REMOVAL

or

Track 2, svgcoat2:
Coat Program 7 - Shipley 3612 resist 1.0µm (dispenser 1) WITH 2mm EDGE BEAD REMOVAL
Coat Program 2 - Shipley 3612 resist 1µm or 1.6µm (dispenser 1) WITHOUT EDGE BEAD REMOVAL


Step 3:
Prebake Program 1 - Prebake for 3612 resist 1.0µm at 90°C, 60 seconds

Detailed Procedure:

Please read the Optical Photolithography Overview.


Please see operating instructions for svgcoat/svgcoat2

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