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Guide to Wafer Production for Etch Tool and Process Qualification Wafers

This page maps out what thin films and masks are needed for the testing of etchers and etch processes. It also lists which test results are required for qualification. Links are provided to specific runsheets used to create the wafers.

Matrix for Qual Wafers

The following table shows the types of wafers to be prepared for various etch quals.  They should not vary from etcher to etcher.

 


 1um Thermal Oxide 1um LTO Oxide
100nm Thermal Oxide
0.6um Nitride (NITRIDE2)
0.5um Poly on 100nm Ox
1um Al/Si on 100nm Ox
Bare Si
Oxide Etch
  EE410 Contact Mask
        Litho Resolution Mask
Nitride Etch
No Mask
    EE410 ISO Mask
    Litho Resolution Mask
Poly Etch
    EE410 Gate Mask
  EE410 Gate Mask
   
Al/Si Etch
EE410 Metal Mask
        EE410 Metal Mask
 

 

Test Results

The following test results will be posted both in coral and on the SNF wiki.

 

For Oxide etching;

            LTO etch rate

            PR etch rate (3612)

            Si etch rate

            LTO :  PR selectivity

            LTO : Si selectivity

            Etch profile in LTO

 

For Nitride etching;

            Nitride2 etch rate

            PR etch rate (3612)

            Thermal Ox etch rate

            Si etch rate

            Nitride : PR selectivity

            Nitride : Ox selectivity

            Nitride : Si selectivity

            Etch profile in Nitride

 

For Poly etching;

Poly etch rate

            PR etch rate (3612)

            Ox etch rate

            LTO :  PR selectivity

            LTO : Ox selectivity

            Etch profile in Poly

 

For Al/Si

Al/Si etch rate

            PR etch rate (3612)

            SOxetch rate

            Al/Si :  PR selectivity

            Al/Si : Si selectivity

            Etch profile in Al/Si

 

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