Equipment Table
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This list provides links to information about specific equipment, by process technique. For more filtered views and searches, we invite you to check out the Labuser Guide Equipment lists.
| Techniques | Equipment Name and link to Instructions | Training |
| Annealing & Oxidation: Furnace Annealing | Thermco Oxidation Furnace | Maurice |
| Annealing & Oxidation: Furnace Annealing | Thermco Oxidation Furnace | Maurice |
| Annealing & Oxidation: Furnace Annealing | Forming Gas Anneal Furnace | Maurice |
| Annealing & Oxidation: Furnace Annealing | FormingGas Anneal Furnace | Maurice |
| Annealing & Oxidation: Rapid Thermal Annealing | AllWin 610 Rapid Thermal Annealer | Maurice |
| Annealing & Oxidation: Rapid Thermal Annealing | AllWin 610 Rapid Thermal Annealer | Maurice |
| Bonding | EV Group Wafer Bonder | Cliff |
| Bonding | Karl Suss Wafer Bonder | Cliff |
| Bonding | Finetech Lambda | Lavendra |
| Characterization: Dynamic Light Scattering | Malvern Dynamic Light Scattering (DLS) Zetasizer | Swaroop |
| Characterization: Ellipsometry | J.A. Woollam M2000 Spectroscopic Ellipsometer | Alex |
| Characterization: Film Stress | Flexus 2320 | Uli |
| Characterization: Minority Carrier Lifetime | Sinton Lifetime Tester | Swaroop |
| Characterization Reflectometry | Nanospec2 Film Thickness Measurement System | Swaroop |
| Characterization Reflectometry | Nanospec3 Film Thickness Measurement System | Cliff |
| Characterization Reflectometry | Filmetrics F40 | Swaroop |
| Characterization Sheet resistance | Prometrix Resistivity Mapping System | Uli |
| Characterization Sheet resistance | Lei1500 Eddy current | Swaroop |
| Characterization: Surface Analysis: AFM | AFM-Asylum | Christina |
| Characterization: Surface Analysis: Interferometry | Sensofar S-neox, non Flexibleact 3D optical profiling | Uli |
| Characterization: Surface Analysis: Microscopy | Keyence Digital Microscope VHX-6000 | Graham |
| Characterization: Surface Analysis: Step Profile | Alphastep 500 Profilometer | Uli |
| Characterization: Surface Analysis: Step Profile | Tencor P2 Profilometer | Uli |
| Characterization | micromanipulator6000 IV-CV probe station | Swaroop |
| Characterization | Jasco UV-Vis-NIR Spectrometer | Swaroop |
| Cleaning: Resist Removal (SRS100/PRS1000) | Wet Bench Resist Strip | Uli |
| Cleaning: Piranha | Clean_resist-piranha-HF Wet Bench | Uli |
| Cleaning: Pre_Diffusion wet | Clean-1 and 2 Wetbench | Uli |
| Cleaning: Pre_Diffusion wet: Germanium | Germanium wbgen-2 | Mary |
| Cleaning: using Solvents | Solvent Wetbench | Uli |
| Cleaning: using Solvents | Lithography Solvent Bench | Uli |
| Deposition: Atomic Layer (ALD) | Fiji Atomic Layer Deposition (fiji1 semi-clean and fiji2 flexible) | Alex |
| Deposition: Atomic Layer (ALD) | Fiji Atomic Layer Deposition (fiji3 flexible) | Alex |
| Deposition: Atomic Layer: Thermal (ALD) | Savannah Atomic Layer Deposition System | Alex |
| Deposition: Atomic Layer: Thermal (ALD) | MVD | Alex |
| Deposition: Chemical Vapor (CVD): Carbon Nanotube | First Nano carbon nanotube CVD furnace | Maurice |
| Deposition: Chemical Vapor (CVD): CVD-Graphene | Aixtron Black Magic graphene CVD furnace | Swaroop |
| Deposition: Chemical Vapor (CVD): Epitaxial | Applied Materials Centurion Epitaxial System | Maurice |
| Deposition: Chemical Vapor: Metal-Organic (MOCVD) | Aixtron MOCVD - III-V system | Jim Peterson |
| Deposition: Chemical Vapor: Metal-Organic (MOCVD) | Aixtron MOCVD - III-N system | Jim Peterson |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | teos2 | Maurice |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | Thermco LPCVD Low Temperature Oxide | Maurice |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | Thermo LPCVD Nitride | Maurice |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | Thermco LPCVD Poly | Maurice |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | Thermco LPCVD Poly2 | Maurice |
| Deposition: Chemical Vapor: Low Pressure (LPCVD) | Tylan BPSG | Maurice |
| Deposition: Chemical Vapor (CVD): Plasma Enhanced | PlasmaTherm Versaline HDP VCD System | Lavendra |
| Deposition: Chemical Vapor (CVD): Plasma Enhanced | PlasmaTherm Shuttlecock PECVD System | Lavendra |
| Drying: CO2 Drying | Critical Point Dryer | Uli |
| Etching: Dry-Downstream | Gasonics Aura Asher | Lavendra |
| Etching: Dry-Downstream | Matrix Plasma Resist Strip | Lavendra |
| Etching: Dry-ICP | Lam Research TCP 9400 Poly Etcher | Lavendra |
| Etching: Dry-ICP | Oxford III-V etcher | Lavendra |
| Etching: Dry-ICP | Plasma Therm Versaline LL ICP Deep Silicon Etcher | Lavendra |
| Etching: Dry-ICP | Plasma Therm Versaline LL ICP Metal Etcher | Lavendra |
| Etching: Dry-ICP | Plasma Therm Versaline LL ICP Dielectric Etcher | Lavendra |
| Etching: Dry-ICP | STS Deep RIE Etcher | Lavendra |
| Etching: Dry-MERIE | Applied Materials P5000 Etcher | Lavendra |
| Etching: Dry-RIE | MRC Reactive Ion Etcher | Lavendra |
| Etching: Dry-RIE | Oxford Dielectric Etcher | Lavendra |
| Etching: Dry-RIE | plasmaetch_pe-50 | Carsen |
| Etching: Dry-RIE &PE | SAMCO | Lavendra |
| Etching: Vapor Etching | SPTS uetch vapor etch | Lavendra |
| Etching: Vapor Etching | Xactix Xenon Difluoride Etcher | Lavendra |
| Etching: Wet: Acids or Bases | Flexible Corrosive Wetbench and GaAs | Uli / Mary |
| Etching: Wet: Acids or Bases | Flexible Corrosive Wetbench | Uli / Mary |
| Etching: Wet: Aluminum (clean) | Clean-3 and Decon Wetbench | Uli |
| Machining: Laser Cutting | Lasercutter | Maurice |
| Machining: Micromilling | Micromill | Elmer |
| Machining: Wafer Backgrinding | DISCO Backgrind | Saeed |
| Machining: Wafer Polishing | GnP Poli-400L | Graham |
| Machining: Wafer Sawing | DISCO Wafer Saw | Swaroop |
| Metallization: Evaporation | AJA Evaporator | Graham |
| Metallization: Evaporation | AJA2 Evaporator | Graham |
| Metallization: Evaporation | Innotec ES26C E-Gun Evaporator | Maurice |
| Metallization: Evaporation | IntlVac Nanochrome I Evaporator System | Maurice |
| Metallization: Sputtering | Lesker Sputter | Maurice |
| Metallization: Sputtering | Lesker2 Sputter | Graham |
| Metallization: Sputtering | Hummer V Sputter Coater | Carsen |
| Optical Photolithography: Exposure: Contact Aligner | EV Group Contact Aligner | Cliff |
| Optical Photolithography: Exposure: Contact Aligner | Karl Suss MA-6 Flexibleact Aligner 1&2 | Uli |
| Optical Photolithography: Exposure: Direct Write | Heidelberg MLA 150 | Swaroop |
| Optical Photolithography: Exposure: Direct Write | Heidelberg MLA 150 - 2 | Swaroop |
| Optical Photolithography: Exposure: Stepper | ASML PAS 5500/60 i-line Stepper | Cliff |
| Optical Photolithography: Wafer Prime HMDS | YES Prime Oven | Cliff |
| Optical Photolithography: Resist Coat (automatic) | SVG Resist Coat Tracks 1&2 | Uli |
| Optical Photolithography: Resist Coat (manual) | Headway2 Manual Resist Spinner | Cliff |
| Optical Photolithography: Resist Coat (manual) | Headway3 Manuel Resist Spinner | Swaroop |
| Optical Photolithography: Resist Coat (manual) | Laurell Manual Resist Spinner | Cliff |
| Optical Photolithography: Resist Spray Coat | EVG 101 Resist Spray Coater | Cliff |
| Optical Photolithography: Resist Develop (automatic) | SVG Resist Develop tracks 1&2 | Uli |
| Optical Photolithography: Resist Develop (manual) | Resist Develop Wetbench Cleanroom | Uli |
| Optical Photolithography: Resist Develop (manual) | Resist Develop Wet Bench ExFAb | Swaroop |
| Optical Photolithography: Resist Bake | Blue M Programmable Oven | Cliff |
| Optical Photolithography: Resist Bake | 110 C Oven | Uli |
| Optical Photolithography: Resist Bake | 90 C Oven | Uli |
| Optical Photolithography: Resist Bake | White Oven | Cliff |
| Optical Photolithography: Resist Bake | Ultraviolet Photoresist Cure | Cliff |
| Optical Photolithography: Mask Cleaning (KS or EV) | Mask Scrubber | Cliff |
| Ex Fab: Flexible Environment | Glovebox- side with spin coater | Alex |
| Ex Fab: Flexible Environment | Glovebox- side with transfer station | Alex |
| Ex Fab: Flexible Environment | Fumehood 1 | Swaroop |
| Ex Fab: Flexible Environment | Fumehood 2 | Swaroop |
| Ex Fab: Flexible Environment | Fumehood 3 | Swaroop |
| Ex Fab: Flexible Environment | Fumehood 4 | Swaroop |
| Ex Fab: Deposition | PDS 2010 LABCOTER 2 | Swaroop |
| ExFab: Patterning | Solidscape 3D Wax Printer | Swaroop |
| ExFab: Patterning | Fujifilm Dimatix Ink Jet Printer | Swaroop |
| ExFab: Patterning | Nanoscribe Photonics GT | Swaroop |
| ExFab: Patterning | Optomec Printer | Swaroop |
| ExFab: Patterning | Alveole Primo | Swaroop |
| ExFab: Wet Processing | WbExfab_Solv | Swaroop |
| Other | Fisher AccuSpin 24C | Swaroop |
| Other | IKA disperser | Swaroop |
| Other | Thinky mixer | Swaroop |
| Other | Q700 Probe Sonicator | Swaroop |
| Other | SCS G3P-8 Spin Coater | Swaroop |
| Other | Torrey Pines Hotplate | Swaroop |